OLED Display Panel Groove-Enhanced Packaging for Film Peeling
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Solution Overview
Problem
OLED display panels face film peeling issues due to weak bonding forces between the packaging layer and the underlying array substrate, particularly exacerbated by high temperature and humidity, which affects their bending performance and lifespan.
Innovation Solution
A display panel design featuring a substrate with a buffer layer, insulating layer, interlayer insulating layer, crack preventing member, banks, and multiple inorganic and organic packaging layers, where recessed grooves and filled layers enhance bonding forces and bending resistance, reducing the risk of film peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a thin film encapsulation method is adopted to achieve flexible display, then the device can be bent, but edge peeling occurs at high temperature and high humidity test
Solution Approach 1:
The encapsulation structure is divided into multiple inorganic layers (first and second inorganic packaging layers) separated by organic layers. This segmentation allows each layer to perform specific functions: inorganic layers provide moisture barrier while organic layers provide flexibility and stress relief, resolving the contradiction between bending performance and bonding strength
Solution Approach 2:
The patent uses composite inorganic/organic packaging layers where inorganic materials (such as silicon nitride, silicon oxide) provide moisture barrier properties and organic materials provide flexibility. This composite structure enables both bending capability and reliable bonding, preventing edge peeling during high temperature and humidity testing
2Reliability
If rigid package is used to protect metal electrodes and luminescent materials, then moisture protection is improved, but the device cannot be bent
Solution Approach 1:
The patent replaces rigid packaging with thin film encapsulation consisting of multiple flexible inorganic and organic layers. These thin films maintain moisture protection functionality while allowing the device to bend, directly resolving the contradiction between moisture protection and bending capability
Data Source
AI summary
A display panel is provided. A side surface of an interlayer insulating layer away from the substrate is partially recessed to a substrate so as to form a first groove. A crack preventing member is filled in the first groove and is connected to the substrate, so a connection of the organic layer to the organic layer is achieved, thereby increasing a bending resistance of the display panel and reducing the risk of film peeling. In addition, a side surface of the interlayer insulating layer disposed between the first groove and the banks away from the substrate is partially recessed to form a second groove, and the first inorganic packaging layer is filled in the second groove. An inorganic layer of the packaging layer is connected to an inorganic layer of an array substrate, thereby increasing a bending resistance of the display panel and reducing the risk of film peeling.