OLED Display Panel Bezel Width Reduction via Inorganic Spacer Layer
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Solution Overview
Problem
Current OLED display panels with capacitive touch technology face challenges in minimizing the bezel width due to the extension of the inorganic encapsulation layer into the wire replacement region, which complicates the etching process and increases the distance between the wire replacement region and the display region.
Innovation Solution
The implementation of an inorganic spacer layer stacked with an inorganic encapsulation sub-layer, which allows for increased thickness and precise etching in the wire replacement region, enabling the touch trace to be connected to the metal trace without overlapping with the wire replacement region, thus reducing the bezel width and allowing the wire replacement region to be positioned closer to the display region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the inorganic encapsulation layer extends into the wire replacement region, then the encapsulation coverage is improved, but the etching process becomes complex and the bezel width increases
Solution Approach 1:
The patent divides the encapsulation structure into two separate layers: an inorganic encapsulation layer and an organic encapsulation layer. The inorganic layer provides coverage over the display region and extends into the wire replacement region, while the organic layer is deposited subsequently to fill gaps and provide additional protection. This segmentation allows each layer to perform its specific function without creating etching complexity.
Solution Approach 2:
The patent employs a preliminary action by depositing the inorganic encapsulation layer first, allowing it to extend into the wire replacement region before the organic layer is deposited. This preliminary deposition establishes the base coverage, and the subsequent organic layer deposition fills in any gaps created by the inorganic layer's extension, simplifying the overall etching process.
2Reliability
If the inorganic encapsulation layer extends into the wire replacement region, then the encapsulation coverage is improved, but the bezel width increases
Solution Approach 1:
By segmenting the encapsulation into inorganic and organic layers, the patent allows the inorganic layer to extend into the wire replacement region for coverage while the organic layer manages the bezel area separately. This segmentation enables the wire replacement region to be positioned closer to the display region without increasing the visible bezel width.
Solution Approach 2:
The patent applies local quality by having the inorganic encapsulation layer extend specifically into the wire replacement region where it is needed for coverage, while the organic layer provides additional protection in the bezel area. This localized approach allows the wire replacement region to be positioned closer to the display region without uniformly increasing the bezel width throughout the entire panel.
3Manufacturing precision
If the wiring replacement hole is disposed outside the cover range of the inorganic layer, then the inorganic layer thickness is maintained, but the wiring replacement hole must be disposed in a direction away from the display region
Solution Approach 1:
The patent segments the encapsulation function between two layers: the inorganic layer maintains its thickness and coverage in the display region, while the organic layer extends into the wire replacement region. This allows the wiring replacement hole to be positioned closer to the display region without compromising the inorganic layer's thickness or requiring it to extend into the hole area.
Solution Approach 2:
The organic encapsulation layer acts as an intermediary that bridges the gap between the inorganic layer and the wire replacement region. It allows the inorganic layer to maintain its optimal thickness and coverage characteristics while providing the necessary protection and structural support in the wire replacement area, enabling the hole to be positioned closer to the display region.
Data Source
AI summary
A display panel, a manufacturing method thereof and a display device are provided. A thin film transistor layer disposed on a substrate includes a first metal trace at least disposed in a wire replacement region. An encapsulation layer includes an inorganic encapsulation sub-layer, which is disposed on one side of the thin film transistor layer away from the substrate and stacked with an inorganic spacer layer. A touch metal layer includes a touch trace, which is at least disposed in the wire replacement region and electrically connected to the first metal trace. Both the inorganic encapsulation sub-layer and the inorganic spacer layer are not overlapped with the wire replacement region.