Reflective Encapsulation Base for OLED Display Panel
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Solution Overview
Problem
Existing encapsulating methods for OLED display panels are inadequate in preventing external water and oxygen from corroding light-emitting devices, leading to suboptimal protection and potential product yield issues.
Innovation Solution
A display panel design featuring a reflective encapsulation base that surrounds the display area, a power bus located in the lead-out area connected to the binding part, and an encapsulation adhesive and cover plate to seal the light-emitting devices, thereby enhancing protection and encapsulating effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing encapsulating methods are used, then the light-emitting devices are encapsulated, but the encapsulating effect is insufficient to prevent external water and oxygen from corroding the light-emitting devices
Solution Approach 1:
The patent implements a multi-layer encapsulation structure where the encapsulation base is positioned between the substrate and the encapsulation adhesive, creating a nested configuration. This nested design provides multiple barriers against water and oxygen, significantly improving the encapsulating effect and protecting the light-emitting devices from corrosion.
Solution Approach 2:
The encapsulation base serves as an intermediary layer between the substrate and the encapsulation adhesive. This intermediary structure enhances the overall encapsulation system by providing additional protection and improving the bonding interface, thereby preventing harmful factors from reaching the light-emitting devices.
2Reliability
If the encapsulation adhesive is used to seal the light-emitting devices, then protection is provided, but the connection between the encapsulation cover plate and the driving backplane may be weak
Solution Approach 1:
The encapsulation base acts as an intermediary layer that enhances the connection between the encapsulation adhesive and the encapsulation cover plate. This intermediary structure provides a robust bonding interface, strengthening the connection between the cover plate and the driving backplane while maintaining the protective function.
3Reliability
If the encapsulation base is positioned to surround the display area, then the encapsulating effect is improved, but the light intensity for the encapsulation adhesive may be insufficient
Solution Approach 1:
The patent utilizes the reflective properties of the encapsulation base to convert potential light loss into a beneficial effect. The reflective surface redirects light onto the encapsulation adhesive, enhancing the curing process and ensuring adequate light intensity for proper bonding, while simultaneously maintaining the improved encapsulating effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution improves the encapsulating effect by enhancing light intensity for the encapsulation adhesive, improving its curing degree, and securing the connection between the encapsulation cover plate and the driving backplane, thus reducing the risk of cracks and improving product yield.
Implementation Method 1
the encapsulation base is a reflective structure
Data Source
AI summary
A display panel includes a display area and a peripheral area including a lead-out area, the lead-out area including a binding part. The display panel includes a driving backplane, light-emitting devices, encapsulation adhesives and an encapsulation cover plate. The driving backplane includes a substrate and a circuit layer; the circuit layer includes an encapsulation base and a power bus, which are distributed in a direction away from the substrate; the encapsulation base is arranged in the peripheral area and surrounds the display area; the power bus is at least partially located in the lead-out area; the portion of the power bus located in the lead-out area is located between the display area and the binding part, and is connected to the binding part; the encapsulation base at most overlaps with the portion of the power bus located in the lead-out area.