OLED Display Protecting Substrate Heat Radiation and Rigidity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing organic light emitting diode (OLED) display devices face challenges in achieving sufficient rigidity and effective heat radiation, leading to potential detachment and cracking issues due to external pressure, and limitations in design and attachment methods.
Innovation Solution
The solution involves attaching a printed circuit board directly to a protecting substrate with enhanced rigidity, which includes a heat conductive adhesive layer and a pattern film for improved heat radiation and structural integrity, eliminating the need for additional frames and reducing temperature deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If additional frames are used to support and protect the display panel, then rigidity and protection are improved, but device complexity and weight increase
Solution Approach 1:
The patent combines the protecting substrate and the heat radiation function into a single integrated component. The protecting substrate is configured to both support the display panel and radiate heat, eliminating the need for separate frames and heat radiation structures, thus reducing device complexity while maintaining rigidity.
Solution Approach 2:
The protecting substrate serves multiple functions simultaneously: it provides mechanical support and rigidity for the display panel, acts as a heat radiation structure, and serves as a mounting surface for the printed circuit board. This multi-functionality reduces the overall number of components needed in the device.
2Reliability
If frames are used to protect the display panel, then protection against external pressure is improved, but weight increases
Solution Approach 1:
The protecting substrate is designed as a thin yet rigid structure that provides adequate protection against external pressure without the weight of traditional thick frames. The substrate maintains structural integrity while being lightweight, achieving both protection and weight reduction.
3Temperature
If multiple frames are used for heat radiation, then heat radiation efficiency is improved, but device complexity increases
Solution Approach 1:
The protecting substrate is designed with heat radiation fins or extended surfaces integrated directly into its structure. This merging of the support structure and heat radiation structure eliminates the need for separate heat radiation components, reducing device complexity while maintaining effective heat dissipation.
4Reliability
If the printed circuit board is attached through multiple layers, then attachment reliability is improved, but heat conduction efficiency decreases
Solution Approach 1:
The patent extracts the heat conduction function from the adhesive layers and concentrates it into a dedicated heat conductive adhesive layer positioned between the protecting substrate and the printed circuit board. This allows other adhesive layers to focus on attachment reliability while the specialized layer handles heat conduction, optimizing both functions separately.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the rigidity and heat radiation properties of the OLED display device, preventing detachment and cracking, while allowing for various designs and colors, and improving temperature uniformity by directly attaching the printed circuit board to the display panel through a protecting substrate with high heat conductivity.
Implementation Method 1
a heat conductive adhesive layer attached to the array substrate
Data Source
AI summary
Discussed is an organic light emitting diode display device, including a display panel including an array substrate configured to display an image, a face sealing metal layer under the array substrate, and a protecting substrate under the face sealing metal layer, wherein the array substrate generates heat, and the generated heat is transferred from the array substrate to the protecting substrate via the face sealing metal layer to be radiated by the protecting substrate; and a printed circuit board under the protecting substrate, wherein an end portion of the array substrate, an end portion of the face sealing metal layer and an end portion of the protecting substrate form a stepped structure.