OLED Display Device with Vertical Integrated Circuit Integration
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Solution Overview
Problem
Existing OLED display devices have a wide frame due to the occupation of display area by integrated circuit regions, leading to a reduction in the available display area.
Innovation Solution
The integrated circuit is bonded between the substrate and the OLED, with lead regions and insulating layers arranged to connect the circuit to the OLED, allowing for a narrow frame design by positioning the circuit below the display region and using an encapsulation structure that includes a planarization film, encapsulation thin film, and transparent substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the integrated circuit is arranged around the display region (in lead regions), then the circuit can be properly connected and housed, but the display area is reduced and the frame becomes wide
Solution Approach 1:
The patent moves the integrated circuit from the horizontal plane (around the display region) to the vertical dimension (between substrate and OLED). This dimensional transition allows the circuit to be housed in the thickness direction rather than occupying lateral display area, thereby maximizing the display region while maintaining proper circuit integration.
Solution Approach 2:
The integrated circuit is nested within the vertical stack between the substrate and OLED layers. This nesting approach allows the circuit to be contained within the device structure without protruding laterally, enabling a narrow frame design while keeping all necessary components integrated.
2Area of stationary object
If the integrated circuit is placed between substrate and OLED, then the display area is maximized with narrow frame, but the circuit connection and lead routing become more complex
Solution Approach 1:
The patent divides the vertical structure into distinct functional layers: substrate, integrated circuit, insulating layers with via-holes, lead regions, OLED, and encapsulation. This segmentation allows each layer to be optimized independently and facilitates modular manufacturing and assembly processes.
Solution Approach 2:
Insulating layers with via-holes serve as intermediary structures that enable electrical connections between the integrated circuit and lead regions. These intermediary layers provide controlled pathways for signal and power transmission while maintaining electrical isolation where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a narrow frame OLED display device by maximizing the display area without occupying any display region, enabling a more compact design and the integration of additional modules like memory and Bluetooth modules.
Implementation Method 1
an encapsulation structure arranged above the substrate, and an OLED arranged between the substrate and the encapsulation structure
Data Source
AI summary
The present disclosure relates to the field of organic electroluminescence and provides an OLED display device, a non-contact IC card and a flexible display device. The OLED display device includes a substrate, an encapsulation structure arranged above the substrate, and an OLED arranged between the substrate and the encapsulation structure. A region where an integrated circuit of the display device is bonded is arranged between the substrate and the OLED.