OLED Display Vias for Rear Surface Driver Mounting
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Solution Overview
Problem
In compact electronic devices, the size of the driver ledge for liquid crystal displays and the area consumed by attachment structures for flexible printed circuit cables result in larger border regions than desired, limiting the available space for active display pixels.
Innovation Solution
The use of vias formed in the display substrate layer, either before or after completion, which are filled with conductive materials and connected to the rear surface to route signals, allowing for the attachment of circuitry on the rear surface, thereby minimizing the need for front surface attachments and reducing inactive border regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If driver circuitry is mounted on the front surface using a ledge structure, then the driver can be easily connected to the display, but the border region size increases
Solution Approach 1:
The patent inverts the conventional mounting approach by moving the driver circuitry from the front surface to the rear surface of the display. Vias are formed through the display substrate to establish electrical connections, allowing the driver to be mounted on the rear surface where it does not occupy front surface area, thus reducing border region size while maintaining connection functionality.
Solution Approach 2:
The patent transitions the driver mounting location from a two-dimensional front surface to a three-dimensional rear surface configuration. By utilizing the depth dimension and forming vias through the substrate, the driver is positioned in a different spatial plane, eliminating the need for front surface ledge structures and reducing the border region.
2Ease of operation
If flexible printed circuit cable attachment structures are used, then the driver can be connected to the display, but the area consumed by attachment structures increases
Solution Approach 1:
The patent inverts the attachment approach by moving the connection point from the front surface to the rear surface. Instead of attaching flexible printed circuit cables to the front surface with visible attachment structures, the cables are routed to the rear surface where they connect to vias, eliminating the need for large front surface attachment areas.
3Area of stationary object
If vias are formed in the display substrate layer to route signals through the rear surface, then the active display area increases, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the display structure into distinct layers with vias forming vertical interconnection channels. The via formation process is divided into separate steps (drilling/etching, coating, filling, planarization) that can be integrated into existing manufacturing workflows, managing complexity through systematic process segmentation.
Solution Approach 2:
The patent performs via formation operations at predetermined stages in the manufacturing process, either before or after completing the display structure. This preliminary action allows for careful planning and integration of the via formation steps into the overall manufacturing sequence, managing complexity through proactive process design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes the inactive border regions on the display, allowing for a larger active display area and more efficient use of space by routing signals through the rear surface, thus enhancing the compactness and performance of electronic devices.
Implementation Method 1
Vias may be formed in a display substrate layer by laser drilling, etching, or other via hole formation techniques.
Implementation Method 2
The vias may be at least partially filled with a conductive material such as metal using electroplating or other metal deposition techniques.
Implementation Method 3
The organic light-emitting diode display may, for example, have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant.
Data Source
AI summary
An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant. Vias may be formed in the substrate layer. The vias may be formed before completion of the display or after completion of the display. The vias may be filled with metal using electroplating or other metal deposition techniques. The vias may be connected to contacts on the rear surface of the display. The vias may be located in active regions of the display or inactive regions of the display. The display may include a top surface emission portion and a bottom surface emission portion.