OLED Panel Dummy Pad for Reworking Driver IC Chips
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Solution Overview
Problem
Existing OLED devices face issues with reusability due to damage of the pad portion during reworking procedures, as the anisotropic conductive film (ACF) removal also removes the weak adhesive buffer layer, rendering the OLED panel unusable.
Innovation Solution
Incorporating a dummy pad portion on the non-display area of the OLED panel, allowing for the attachment of driver IC chips and printed circuit boards, enabling the removal of faulty components and reattachment to the dummy pad without damaging the panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If the ACF is removed using a chemical solution during reworking, then the ACF can be removed from the buffer layer, but the buffer layer is also removed together with the ACF, causing damage to the pad portion
Solution Approach 1:
The invention divides the bonding structure into separate functional layers: a lower buffer layer for initial bonding and an upper adhesion layer for driver IC attachment. This segmentation allows the buffer layer to be removed with the ACF during reworking without damaging the pad portion, since the adhesion layer remains intact on the pad surface to support subsequent bonding operations
Solution Approach 2:
The adhesion layer is formed on the pad portion before the buffer layer is removed during reworking. This preliminary action ensures that when the ACF and buffer layer are removed using chemical solution, the pad portion still has the adhesion layer providing structural support and bonding capability, preventing pad damage
2Device complexity
If the driver IC chip is reattached to the same pad portion after removal, then the reworking procedure is simple, but the pad portion is damaged and the OLED device cannot be reused
Solution Approach 1:
The invention creates a duplicate pad structure called a dummy pad portion that serves as a backup bonding location. When the original pad portion is damaged during reworking, the driver IC chip can be attached to the dummy pad portion instead, which has the same structural characteristics and bonding capabilities, thus enabling device reuse without complicating the overall reworking procedure
3Ease of repair
If the buffer layer is designed with weak adhesive strength to allow ACF removal, then the ACF can be removed during reworking, but the pad portion is damaged when the buffer layer is removed
Solution Approach 1:
The bonding structure is segmented into two distinct layers with different functions: the buffer layer with weak adhesive strength designed for easy ACF removal, and the adhesion layer with strong bonding capability that remains on the pad portion. This segmentation allows the buffer layer to be sacrificially removed during reworking while the adhesion layer maintains pad portion structural integrity
Solution Approach 2:
The buffer layer is designed as a disposable, sacrificial layer that is intentionally made with weak adhesive strength so it can be easily removed along with the ACF during reworking procedures. Its temporary nature allows it to serve its bonding purpose during assembly and then be discarded during repair without causing damage to permanent structures
Data Source
AI summary
An organic light emitting display device is disclosed. The organic light emitting display device includes: an organic light emitting display panel defined into a display area for displaying an image and a non-display area surrounding the display area; a chip-on-film loaded with a driver IC chip, which is configured to drive the organic light emitting display panel, and attached to a pad portion which is formed on the non-display area of the organic light emitting display panel; and a printed circuit board configured to apply signals to the driver IC chip and attached to one edge of the chip-on-film, wherein the organic light emitting display panel includes a dummy pad portion which is formed on the non-display area in the same configuration as the pad portion and in opposition to the pad portion.