OLED Display Edge Patterning for Protection Layer Flow Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing light emitting display apparatus faces limitations in controlling the flow of the protection layer, leading to reduced touch sensitivity and display quality due to the intrusion of the protection layer into the driving circuit area and external factors like moisture and oxygen, which affects the organic light emitting diode layer's performance.
Innovation Solution
The implementation of a first pattern and a second pattern in the light emitting display apparatus, along with a dam, to control the flow of the second protection layer, minimizing its overflow into the driving circuit area and improving the thickness and stability of the protection layer in the non-active area, thereby enhancing touch sensitivity and display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the protection layer is applied to cover the light emitting diode layer, then the light emitting diode layer is protected from moisture and oxygen, but the protection layer intrudes into the driving circuit area causing reduced touch sensitivity
Solution Approach 1:
The protection layer is divided into a first protection layer and a second protection layer with different materials and functions. The first protection layer (inorganic) provides barrier protection, while the second protection layer (organic) provides planarization and additional protection without intruding into the driving circuit area, thus maintaining touch sensitivity.
Solution Approach 2:
Different regions of the protection layer have different materials and properties. The first protection layer uses inorganic material for moisture and oxygen barrier in the light emitting diode area, while the second protection layer uses organic material for planarization in the non-active area, optimizing both protection and touch sensitivity locally.
2Reliability
If the protection layer is made thicker to improve protection, then moisture and oxygen blocking is enhanced, but the flow control becomes difficult and intrusion into driving circuit area increases
Solution Approach 1:
The thick protection layer is segmented into two thinner layers with different materials. The first inorganic layer provides effective barrier protection at a thin thickness, while the second organic layer is applied as a separate step with controlled flow, preventing intrusion into the driving circuit area.
Solution Approach 2:
The first protection layer is applied and cured before applying the second protection layer. This preliminary action creates a stable base that controls the flow of the second layer, preventing it from intruding into the driving circuit area while still providing adequate protection.
3Manufacturing precision
If the protection layer thickness is reduced in the non-active area, then flow control is improved and driving circuit area is protected, but touch sensitivity decreases due to insufficient thickness
Solution Approach 1:
The second protection layer is applied with different thickness in different regions. In the non-active area, it is applied thicker to maintain touch sensitivity, while the first protection layer and dam structure control the flow to prevent intrusion into the driving circuit area, achieving local optimization.
Solution Approach 2:
The dual-layer protection structure combines inorganic and organic materials with different properties. The inorganic first layer provides barrier function at minimal thickness, while the organic second layer provides planarization and touch sensitivity in the non-active area without compromising flow control.
4Reliability
If the first protection layer and second protection layer are applied sequentially, then comprehensive protection is achieved, but the manufacturing process complexity increases
Solution Approach 1:
The protection process is segmented into two sequential steps: applying the first inorganic protection layer and curing it, then applying the second organic protection layer and curing it. This segmentation enables comprehensive protection while using standard sequential manufacturing processes.
Solution Approach 2:
The dual-layer protection structure serves multiple functions: the first layer provides moisture and oxygen barrier, the second layer provides planarization and additional protection. This multi-functionality is achieved through a systematic two-step process that, while sequential, uses standard manufacturing techniques for each layer.
Data Source
AI summary
Discussed is a light emitting display apparatus that can include a substrate including an active area and a non-active area adjacent to the active area, a planarization layer in the active area and in a first part of the non-active area, a bank layer, a light emitting diode layer, and a first pattern disposed on the planarization layer, and a second pattern and a dam disposed in a second part adjacent to the first part of the non-active area, the second pattern and the dam having different heights.