Multilayer Encapsulating Film for OLED Moisture Protection
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Solution Overview
Problem
Organic electronic devices, such as OLEDs, are vulnerable to moisture and oxygen, leading to issues like increased resistance and degradation due to oxidation at the electrode interface, which affects their emissive function and luminescence.
Innovation Solution
A method involving a laminated encapsulating film with a pressure-sensitive adhesive (PSA) first layer and a curable adhesive second layer, where the first layer has a lower elastic modulus than the second layer, incorporating a moisture scavenger to enhance moisture blocking properties, is used to protect the devices from external factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single-layer encapsulating film is used, then the device structure is simple, but the moisture blocking property is insufficient
Solution Approach 1:
The encapsulating film is divided into multiple layers (first layer, second layer, and third layer) with different functions. The first layer provides adhesion, the second layer provides moisture blocking, and the third layer provides protection, thereby improving moisture blocking property while maintaining reasonable structural complexity
Solution Approach 2:
The patent uses composite material structure where each layer is made of different materials optimized for specific functions. The first layer uses adhesive material, the second layer uses moisture-blocking material, and the third layer uses protective material, achieving superior moisture blocking through material composition rather than single material
2Area of stationary object
If the encapsulating film is applied to a large-scale device, then complete coverage is achieved, but bubbles may form during application
Solution Approach 1:
The encapsulating film is segmented into multiple layers that can be applied sequentially. This allows each layer to be applied and adjusted separately, making it easier to eliminate bubbles during the application process while maintaining large-scale coverage
Solution Approach 2:
The patent employs thin film structure for the encapsulating film that can conform to large-scale device surfaces. The flexible thin film nature allows for easier application without trapping bubbles, while still achieving complete coverage of large areas
3Reliability
If a moisture scavenger is added to the encapsulating film, then moisture blocking property is enhanced, but the film may detach due to expansion stress
Solution Approach 1:
The moisture scavenger function is segregated into a specific layer (second layer) rather than distributed throughout all layers. This concentrates the moisture absorption function in one location, allowing other layers to maintain their adhesive and structural functions without being compromised by expansion stress
Solution Approach 2:
The patent creates a composite structure where the second layer is specifically designed as a moisture scavenging layer with materials that absorb moisture without excessive expansion. This composite approach balances moisture blocking enhancement with maintaining adhesive strength by using materials and结构设计 that accommodate moisture absorption while preventing detachment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively provides excellent moisture blocking and durability to the electronic devices, preventing degradation and maintaining their functional integrity.
Implementation Method 1
the first layer includes a pressure-sensitive adhesive (PSA) component
Implementation Method 2
the encapsulating film includes first and second layers having different physical properties and/or components... incorporating a moisture scavenger to enhance moisture blocking properties
Implementation Method 3
the second layer includes an adhesive composition... the second layer is in contact with the diode
Data Source
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AI summary
Provided is a method of manufacturing an electronic device. An electronic device having excellent moisture blocking property and durability may be provided by the method.