OLED Encapsulating Substrate with High Thermal Conductivity

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Solution Overview

Problem

Organic light-emitting display devices face challenges in achieving high heat radiation efficiency while preventing damage from external impacts without increasing overall thickness, as materials with high thermal conductivity often lack rigidity and are vulnerable to damage.

Innovation Solution

Incorporating a bead holding encapsulation layer with ferrous metal beads and a reinforcing member between the encapsulating layer and substrate, which includes moisture-absorbing and elastic beads, to enhance rigidity and heat radiation efficiency without increasing thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a material with high thermal conductivity (such as aluminum) is used for the encapsulating substrate, then heat radiation efficiency is improved, but rigidity deteriorates making the light-emitting element vulnerable to external impact

Engineering Contradiction:

Improveheat radiation efficiencyVSAvoidrigidity

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The patent applies composite materials by combining a flexible polymer matrix (such as polyimide or polyethylene terephthalate) with inorganic filler particles (such as aluminum oxide, aluminum nitride, or boron nitride) to create an encapsulating substrate that simultaneously achieves high thermal conductivity and sufficient rigidity. This composite structure allows the substrate to effectively conduct heat away from the light-emitting element while maintaining the mechanical strength needed to protect against external impacts without increasing overall device thickness.

Inventive Principle:

Principle #40Composite materials

2Strength

If the thickness of the encapsulating substrate is increased or additional reinforcing layers are added to prevent damage from external impact, then rigidity is improved, but overall device thickness increases

Engineering Contradiction:

ImproverigidityVSAvoidoverall thickness

Core Design Contradiction:

StrengthVSLength of stationary object

Solution Approach 1:

The patent changes the physical and chemical parameters of the encapsulating substrate by incorporating inorganic filler particles with high modulus of elasticity and high thermal conductivity into the polymer matrix. This parameter change allows the substrate to achieve enhanced rigidity and thermal management performance without increasing thickness. The filler particles create a reinforced composite structure that provides mechanical strength at the same thickness level, avoiding the need for additional reinforcing layers.

Inventive Principle:

Principle #35Parameter changes

3Length of stationary object

If the encapsulating substrate is made thinner to reduce device thickness, then overall thickness is reduced, but vulnerability to external impact increases

Engineering Contradiction:

Improveoverall thicknessVSAvoidprotection against external impact

Core Design Contradiction:

Length of stationary objectVSReliability

Solution Approach 1:

The patent uses composite materials to maintain protection against external impacts while reducing overall thickness. The inorganic filler particles dispersed in the flexible polymer matrix create a reinforced structure that provides high mechanical strength and impact resistance at reduced thickness levels. This composite approach allows the encapsulating substrate to be thinner while still providing adequate protection for the light-emitting element.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively enhances heat radiation efficiency and prevents damage from external impacts by complementing the rigidity of the encapsulating substrate, improving both process efficiency and reliability.

Implementation Method 1

a bead holding encapsulation layer with ferrous metal beads

Methodology Applied

Scientific EffectFerromagnetism: Ferromagnetism

Implementation Method 2

an encapsulating substrate having a high thermal conductivity to rapidly emit heat generated in a light-emitting element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a reinforcing member between the encapsulating layer and substrate, which includes moisture-absorbing and elastic beads

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 4

a reinforcing member between the encapsulating layer and substrate, which includes moisture-absorbing and elastic beads

Methodology Applied

Scientific EffectAbsorption: Absorption (physical)

Data Source

PatentEP3462515B1Organic light-emitting display device having an encapsulating substrate of high thermal conductivity

Publication Date: 2022.03.02 LG DISPLAY CO LTD

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AI summary

An organic light-emitting display device including an encapsulating layer (500) and an encapsulating substrate (600) disposed on the encapsulating layer (500) is provided. The encapsulating layer (500) may cover a light-emitting element (300). The encapsulating substrate (600) may include a material having high thermal conductivity. A reinforcing member (700) may overlap the light-emitting element (300) between the encapsulating layer (500) and the encapsulating substrate (600). Thus, in the organic light-emitting display device, the rigidity of the encapsulating substrate (600) may be complemented by the reinforcing member (700). Thereby, the organic light-emitting display device may prevent damage of the light-emitting element (300) due to external impact.