OLED Encapsulation Layers via Atomic Layer Deposition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing organic light-emitting display (OLED) fabrication methods face challenges in effectively protecting the OLED from impurities and high-energy plasma, leading to potential damage during the encapsulation process, and require multiple equipment setups which increase processing time and costs.
Innovation Solution
A method involving the sequential formation of a first and second encapsulation layer using atomic layer deposition (ALD) with varying plasma energies and frequencies, where the first encapsulation layer with a lower thin-film density is formed using low-energy plasma and the second with a higher density using high-energy plasma, both potentially using the same inorganic material, and optionally including a stress release layer to enhance adhesion and minimize damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a single encapsulation layer is formed using high-energy plasma to achieve high thin-film density and effective impurity blocking, then the impurity blocking capability is improved, but the OLED may be damaged by high-energy plasma and adhesion stress increases
Solution Approach 1:
The encapsulation structure is divided into multiple layers: a first encapsulation layer formed using low-energy plasma to protect the OLED from damage and reduce adhesion stress, and a second encapsulation layer formed using high-energy plasma to provide high thin-film density and effective impurity blocking. This segmentation allows each layer to perform its specific function optimally without causing harm to the OLED.
Solution Approach 2:
The first encapsulation layer formed with low-energy plasma acts as a cushioning layer that protects the OLED from the harmful effects of high-energy plasma. This preliminary protective layer prevents direct exposure of the OLED to high-energy plasma, thereby avoiding plasma damage and reducing adhesion stress before the second high-density encapsulation layer is formed.
2Reliability
If multiple equipment setups are used to form encapsulation layers with different plasma energies, then the quality of encapsulation is improved, but the processing time and fabrication costs increase
Solution Approach 1:
The ALD equipment is designed to perform multiple functions by adjusting plasma energy levels. The same equipment can form both the first encapsulation layer using low-energy plasma and the second encapsulation layer using high-energy plasma, eliminating the need for separate equipment setups. This multi-functionality maintains high encapsulation quality while reducing processing time and fabrication costs.
Solution Approach 2:
The plasma energy parameter is changed between forming the first and second encapsulation layers. By adjusting the plasma energy from low to high, the same ALD equipment can create different encapsulation layer properties (protection vs. high density) without requiring different equipment, thereby maintaining reliability while reducing time and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively blocks impurities, reduces adhesion stress, and minimizes damage to the OLED while reducing equipment needs and processing time, thereby enhancing the fabrication efficiency and reducing costs.
Implementation Method 1
the first encapsulation layer is formed by an ALD method using a first plasma generated based on a first energy, and the second encapsulation layer is formed by an ALD method using a second plasma generated based on a second energy
Implementation Method 2
forming a first encapsulation layer, which has a first thin-film density and contains a first inorganic material, on the substrate, and forming a second encapsulation layer, which has a second thin-film density higher than the first thin-film density and contains a second inorganic material, on the first encapsulation layer
Data Source
AI summary
A method of fabricating an organic light-emitting display includes forming an organic light-emitting device (OLED) on a substrate, forming a first encapsulation layer, which has a first thin-film density and contains a first inorganic material, on the substrate, and forming a second encapsulation layer, which has a second thin-film density higher than the first thin-film density and contains a second inorganic material, on the first encapsulation layer.