OLED Thin Film Encapsulation Area Calculation
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Solution Overview
Problem
The existing OLED display technologies face issues with moisture and oxygen permeation due to incomplete sealing by inorganic films, leading to performance deterioration and 'dark spots' caused by the spreading of organic films during deposition, resulting in increased 'dead space' and reduced encapsulation lifespan.
Innovation Solution
A thin film encapsulation method where an organic film and an inorganic film are stacked, with the inorganic film's deposition area extending beyond the organic film's area to cover the organic film's 'tail' formed during deposition, ensuring complete sealing and minimizing excess deposition, thereby reducing moisture and oxygen ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the inorganic film deposition area is extended to cover the spreading organic film tail, then complete sealing is achieved preventing moisture permeation, but dead space increases
Solution Approach 1:
The patent measures the organic film thickness before deposition and uses this measurement to calculate and set the appropriate inorganic film deposition area. This preliminary action ensures the inorganic film is deposited only where needed to cover the organic film tail, achieving complete sealing while minimizing dead space.
Solution Approach 2:
The patent dynamically adjusts the inorganic film deposition area based on the measured organic film thickness parameter. By changing the deposition area parameter according to the organic film thickness, the system optimizes the balance between sealing completeness and dead space minimization.
2Productivity
If the inorganic film deposition area is reduced to minimize dead space, then manufacturing efficiency improves, but moisture permeation occurs causing dark spots
Solution Approach 1:
The patent implements a feedback mechanism where the organic film thickness is measured after deposition, and this measurement feeds back to determine the appropriate inorganic film deposition area. This feedback loop ensures that the inorganic film is deposited with the precise area needed to prevent moisture permeation while minimizing dead space, thereby improving manufacturing efficiency without compromising sealing quality.
3Reliability
If the organic film thickness is increased to improve coverage, then sealing effectiveness improves, but the required inorganic film deposition area increases excessively
Solution Approach 1:
The patent dynamically adjusts the inorganic film deposition area parameter based on the measured organic film thickness parameter. When organic film thickness is increased, the system calculates and sets the corresponding inorganic film deposition area to cover the tail while minimizing excess deposition, optimizing the balance between sealing effectiveness and deposition area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively controls moisture and oxygen permeation, enhances the encapsulation lifespan of OLED displays, reduces 'dead space', and improves production efficiency by ensuring complete coverage of the organic film edges.
Implementation Method 1
a liquid monomer can be deposited on the substrate, and can be hardened by using electron beams or ultraviolet (UV) rays
Data Source
AI summary
An organic light emitting diode display includes a substrate, an organic light emitting diode on the substrate, an organic film configured to cover the organic light emitting diode on the substrate in an organic film deposition area having a first diameter, and an inorganic film configured to cover the organic film on the substrate in an inorganic film deposition area having a second diameter, wherein L1 is the first diameter of the organic film deposition area in μm, wherein L2 is the second diameter of the inorganic film deposition area in μm, wherein D is a thickness of the organic film in μm, and wherein L2−L1≧2 (171D+150 μm).


