OLED Encapsulation Copolymer Resin Composition for Flexible Packaging
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Solution Overview
Problem
Current encapsulation methods for large-area, thin-type, and flexible OLED elements are inadequate, as they either lack mechanical strength or are unsuitable for roll-to-roll processes, and existing materials fail to provide effective protection against oxygen and moisture.
Innovation Solution
A copolymer composed of specific acrylate repeating units and a silicone oligomer, combined with an epoxy resin, is used to create a packaging film with a gas barrier layer and resin layer that provides heat resistance, yellowing resistance, and high adhesion, suitable for encapsulating OLED elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass-frit technique is used for encapsulation, then oxygen and moisture resistance is improved, but flexibility and suitability for large-area thin elements deteriorates
Solution Approach 1:
The patent uses a composite resin composition comprising multiple components: a polymerizable monomer mixture (including acrylic monomers and epoxy monomers), a photoinitiator, and optionally a silane coupling agent. This composite material system combines the benefits of different chemical components to achieve both barrier properties and flexibility, resolving the contradiction between oxygen/moisture resistance and adaptability to flexible substrates.
Solution Approach 2:
The patent optimizes specific parameter ranges: the acrylic monomer comprises 70-95 wt% of the polymerizable monomer, epoxy monomer comprises 5-30 wt%, and the curing process uses specific wavelength UV light (300-400 nm). These parameter optimizations enable the resin to achieve adequate barrier performance while maintaining flexibility and processability for large-area OLED encapsulation.
2Strength
If dam & filling technique is used for encapsulation, then mechanical strength and oxygen/moisture resistance are improved, but process complexity and suitability for roll-to-roll process deteriorates
Solution Approach 1:
The patent applies a primer layer before the resin composition to enhance adhesion to the OLED substrate. This preliminary action ensures strong bonding without requiring complex mechanical interlocking structures, simplifying the overall encapsulation process while maintaining mechanical strength.
Solution Approach 2:
The patent replaces complex mechanical encapsulation structures (like the dam & filling technique) with a chemically-cured resin system that achieves mechanical strength through photopolymerization. This substitution eliminates the need for complex mechanical assembly steps, enabling simpler processing and compatibility with roll-to-roll manufacturing.
3Ease of manufacture
If conventional encapsulation materials are used, then ease of manufacture is maintained, but protection against oxygen and moisture infiltration deteriorates
Solution Approach 1:
The patent creates different functional zones within the encapsulation system: a primer layer for adhesion, a resin composition layer for barrier protection, and optional additional protective layers. Each layer has locally optimized properties, with the resin composition specifically formulated to provide superior oxygen and moisture barrier performance while maintaining ease of application through UV curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copolymer-based resin composition effectively encapsulates OLED elements, offering improved flexibility, heat resistance, and adhesion, while preventing the influx of ambient gases and moisture, making it suitable for large-area, thin-type, and flexible OLED applications.
Implementation Method 1
a gas barrier layer disposed on the release layer
Implementation Method 2
high adhesion, suitable for encapsulating OLED elements
Data Source
AI summary
A copolymer according to the present disclosure is provided, which includes 30 to 80 mol % of a repeating unit represented by formula (I), 5 to 25 mol % of a repeating unit represented by formula (II), and 5 to 30 mol % of a repeating unit represented by formula (III):wherein R1 is C6-C13 aryl group, C7-C13 aralkyl group, C6-C8 halogenated aryl group or C7-C8 aryloxyalkyl group; R3 is C3-C16 alkyl group or C3-C6 alkoxy substituted alkyl group; R5 is a single bond or C1-C3 alkylene group, R6 and R7 are independently C1-C3 alkoxy group, R8 is polysiloxane with methyl and phenyl groups; and R2, R4 and R9 are independently hydrogen or methyl. In addition, a resin composition, a packaging film and a package structure including the same are provided.