OLED Encapsulation Grooves for Adhesion and Moisture Barrier
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The encapsulation layer and light emitting element layer of OLED panels have a weak adhesion force, leading to detachment issues, especially during bending processes, which compromises the moisture barrier and reduces the lifetime and cost-effectiveness of the organic light emitting display.
Innovation Solution
Creating a pinning structure by forming a plurality of grooves in the light emitting element layer and filling them with the encapsulation layer, enhancing the adherence between the encapsulation and light emitting element layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a thin film encapsulation layer is used to isolate OLED from moisture and oxygen, then the protection against environmental factors is improved, but the adhesion force between the encapsulation layer and light emitting element layer becomes weak, leading to detachment
Solution Approach 1:
The patent transitions from a planar encapsulation structure to a three-dimensional structure by forming grooves (first grooves and second grooves) that extend into the light emitting element layer. The encapsulation layer fills these grooves, creating vertical anchoring features that prevent detachment while maintaining the protective barrier function against moisture and oxygen.
Solution Approach 2:
The encapsulation layer is divided into multiple segments by forming grooves that create distinct regions. The first grooves and second grooves segment the encapsulation layer into multiple zones, each providing independent adhesion points. This segmentation allows the encapsulation layer to maintain strong attachment through multiple distributed connection points rather than relying on a single continuous interface.
2Length of stationary object
If the encapsulation layer is made thin to maintain flexibility and reduce device thickness, then the device profile is improved, but the adhesion becomes even weaker and detachment occurs more easily during bending
Solution Approach 1:
Instead of increasing the thickness of the thin encapsulation layer, the patent adds vertical depth through grooves. The first grooves and second grooves create downward extensions that provide anchoring volume without increasing the overall thickness of the encapsulation layer. This allows the layer to remain thin and flexible while gaining enhanced adhesion through the three-dimensional groove structures.
Solution Approach 2:
The encapsulation layer is nested within the groove structures formed in the light emitting element layer. The grooves create nested cavities that the encapsulation layer material fills, forming an interlocked structure. This nesting provides mechanical interlocking that strengthens adhesion without requiring the encapsulation layer to be thicker, maintaining both thinness and strong attachment.
3Strength
If grooves are formed in the light emitting element layer to enhance adhesion, then the adhesion strength is improved, but the manufacturing process complexity increases
Solution Approach 1:
The manufacturing process is segmented into distinct sequential steps: forming first grooves, depositing encapsulation layer, forming second grooves, and filling second grooves. This segmentation allows each step to be optimized independently and performed by specialized equipment, making the overall complex process manageable and scalable for mass production.
Solution Approach 2:
The first grooves are formed in advance before the encapsulation layer is deposited. This preliminary action creates the initial anchoring structure that guides the subsequent encapsulation layer formation. By preparing the groove structures beforehand, the process ensures proper alignment and integration of the encapsulation layer, simplifying the overall manufacturing sequence.
Data Source
AI summary
An organic light emitting display panel and a method for fabricating the same are provided by the present invention. The organic light emitting display panel includes: a substrate and a light emitting element layer disposed on the substrate. The light emitting element layer is provided with a plurality of first grooves. The organic light emitting display panel also includes an encapsulation layer disposed on the light emitting element layer, the plurality of first grooves are filled with the encapsulation layer.