OLED Encapsulation Hole Anchoring for Flexible Display Peeling
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Solution Overview
Problem
Organic light emitting display apparatuses face issues with the organic light emitting layer peeling from the anode electrode when subjected to stress, such as bending or folding, which affects their ability to emit light effectively.
Innovation Solution
The solution involves forming a substrate with a thin film transistor layer, a bank layer, and an encapsulation layer that includes an inorganic and organic layer, with specific holes designed to extend downward and fill into these holes, ensuring the organic light emitting layer is securely fixed to the anode electrode, preventing peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the organic light emitting display apparatus is made flexible to allow folding or bending, then adaptability and versatility are improved, but the organic light emitting layer peels from the anode electrode due to stress, causing reliability to deteriorate
Solution Approach 1:
The patent applies preliminary action by forming a buffer layer and a hole in the substrate before forming the anode electrode and organic light emitting layer. The buffer layer is prepared in advance to absorb stress, and the hole is pre-formed to allow the encapsulation layer to extend downward and fill the hole, creating a stress-absorbing structure that prevents peeling when the display is folded or bent.
Solution Approach 2:
The patent uses the buffer layer as an intermediary element between the substrate and the anode electrode. This buffer layer acts as a mediator that absorbs and distributes stress generated during folding or bending, preventing direct stress transmission to the organic light emitting layer and anode electrode interface, thereby preventing peeling.
2Reliability
If additional manufacturing steps are added to prevent peeling, then reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the hole formation process with existing manufacturing steps. The hole is formed during the same process step as the bank layer formation, combining multiple functions into a single process step. This integration prevents peeling while avoiding additional manufacturing complexity.
Solution Approach 2:
The buffer layer serves multiple functions: it provides a base layer for device formation, absorbs stress during folding/bending, and works with the encapsulation layer to prevent peeling. This multi-functionality reduces the need for separate dedicated stress-management components, simplifying the overall manufacturing process.
Data Source
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AI summary
Disclosed is an organic light emitting display apparatus and a method of manufacturing the same, which prevent an organic light emitting layer from being peeled from an anode electrode.