OLED Encapsulation Structure with Metal Extension Layer for Stress Relief
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Solution Overview
Problem
In the packaging process of OLED display devices, uneven temperature gradients and stress intensities can lead to cracks in the film under the frit, causing breakage of signal lines and abnormal displays due to mismatched thermal expansion coefficients during the laser sealing process.
Innovation Solution
A packaging structure featuring a first substrate with a power supply terminal, a second substrate, and a metal extension layer with via holes for stress relief, extending from the power supply terminal to both ends of the substrate, covered by a packaging layer that matches the width of the metal extension layer, effectively conducting thermal energy and reducing stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a frit packaging process is used with laser sealing, then the packaging process can be completed, but cracks are easily generated on the film under the frit due to uneven temperature gradient and stress intensity
Solution Approach 1:
The patent introduces a stress relief structure with through-holes at specific locations beneath the frit packaging layer. This creates local quality differences in the substrate structure, allowing stress to be relieved at specific points while maintaining overall structural integrity, thereby preventing crack propagation in the film layer during laser sealing.
Solution Approach 2:
The stress relief structure is segmented into multiple through-holes distributed across the substrate. This segmentation allows the stress to be distributed and relieved at multiple discrete locations rather than concentrating in one area, preventing the formation of continuous cracks in the film under the frit.
2Productivity
If the temperature gradient and stress intensity are unevenly distributed, then the packaging process can proceed, but thermal expansion coefficient mismatch causes cracks in the film
Solution Approach 1:
The stress relief structure with through-holes is pre-formed in the substrate before the frit packaging process. This beforehand cushioning structure is designed to absorb and distribute the thermal stress and temperature gradients that will occur during subsequent laser sealing, preventing uneven stress distribution and film cracking while maintaining packaging process efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The packaging structure reduces the risk of signal line breakage by evenly distributing thermal energy and stress, improving the uniformity of the film thickness and preventing cracks, thus ensuring stable display performance.
Implementation Method 1
effectively conducting thermal energy and reducing stress
Implementation Method 2
when a temperature gradient and a stress intensity are unevenly distributed as well as that the temperature gradient and the stress intensity do not match a thermal expansion coefficient of material
Data Source
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AI summary
The present application discloses a packaging structure, the packaging structure includes a first substrate, a side of the first substrate including a power supply terminal; a second substrate; a metal extension layer, extending from the power supply terminal to both ends of the first side of the first substrate; and a packaging layer, covering the metal extension layer and fastening the first substrate and the second substrate. Thereby, the packaging structure provided by the present application effectively utilizes an extension filling of a metal can contribute to conducting thermal energy and improving the breakage of the signal lines.