OLED Encapsulation Substrate Reflective Metal Layer
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Solution Overview
Problem
Conventional OLED display devices face issues with non-uniform voltage application to pixels, leading to inconsistent emission characteristics and mechanical reliability due to the encapsulation substrate not being utilized effectively, causing potential damage from external shocks.
Innovation Solution
Incorporating a conductive material layer and a metal layer between the cathode and the encapsulation substrate to prevent voltage drops and enhance mechanical reliability by reflecting ambient light, with the conductive material layer filling gaps and the metal layer acting as a cathode bus line to maintain electrical connection and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the encapsulation substrate is not used for any purpose other than to support an absorbent, then the device structure is simple, but the mechanical reliability deteriorates due to potential collapse from external shocks
Solution Approach 1:
The encapsulation substrate is transformed from a single-function support structure into a multi-functional component that serves as both a mechanical support and an optical reflective surface. The metal layer deposited on the encapsulation substrate enables light reflection to enhance display brightness, while the substrate itself provides structural support and shock absorption, preventing collapse from external impacts.
Solution Approach 2:
A composite structure is formed by depositing a metal layer on the encapsulation substrate. This composite combines the mechanical strength and shock absorption properties of the substrate with the optical reflection properties of the metal layer, achieving both structural reliability and enhanced light reflection without increasing device complexity.
2Ease of manufacture
If the second electrode is formed on the entire surface of the substrate, then the manufacturing process is simple, but the voltage application uniformity deteriorates leading to non-uniform emission characteristics
Solution Approach 1:
A conductive material layer is introduced as an intermediary between the second electrode and the encapsulation substrate. This intermediate layer fills gaps and irregularities in the substrate surface, providing a uniform conductive path that ensures even voltage distribution across all pixels, thereby improving emission uniformity without complicating the manufacturing process.
3Ease of manufacture
If the encapsulation substrate has a gap with the substrate, then the device assembly is easy, but the harmful factors worsen due to potential contact damage from external shocks
Solution Approach 1:
The encapsulation substrate is designed to overhang the substrate edges, creating a protective overhang structure beforehand. This overhang acts as a cushion that absorbs and distributes external shock forces before they can reach the sensitive OLED structure, preventing contact damage while maintaining easy device assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform voltage application to pixels, improves mechanical reliability by preventing damage from external shocks, and enhances light reflection, resulting in improved display performance and durability.
Implementation Method 1
can reflect ambient light
Implementation Method 2
can prevent a voltage applied to a cathode from dropping
Data Source
AI summary
An organic light emitting diode (OLED) display device, which can use a non-emission surface of an encapsulation substrate to reflect light, can prevent a voltage applied to a cathode from dropping, and has improved mechanical reliability, and a method of manufacturing the same. The OLED display device includes a substrate; a first electrode disposed on the substrate; an organic layer disposed on the first electrode; a second electrode disposed on the organic layer; a conductive material layer disposed on the second electrode; a metal layer disposed on the conductive material layer; an encapsulation substrate disposed on the metal layer; and an encapsulant to combine the substrate with an encapsulation substrate.