Encapsulation Sheet for OLED Moisture Blocking

The patent employs a multi-layer composite encapsulation structure consisting of alternating inorganic barrier layers (such as silicon oxide, silicon nitride, or aluminum oxide) and organic buffer layers (such as silicon oxide or organic polymers). This composite structure combines the excellent moisture and oxygen blocking properties of inorganic materials with the flexibility and stress management advantages of organic materials, achieving superior protection against environmental degradation while maintaining device reliability.

The encapsulation layer is divided into multiple thin sub-layers rather than using a single thick layer. Each inorganic layer provides a specific barrier function against moisture and oxygen, while organic layers provide mechanical flexibility and stress relief. This segmented approach allows each layer to be optimized for its specific function, resulting in enhanced overall blocking performance without excessive complexity.

Instead of increasing thickness in one dimension, the patent transitions to a multi-dimensional approach by stacking multiple thin alternating layers of inorganic and organic materials. This layered structure provides enhanced blocking performance through the cumulative effect of multiple interfaces and the complementary properties of different materials, achieving superior protection with minimal total thickness.

The patent utilizes thin-film deposition techniques to create ultra-thin inorganic barrier layers and organic buffer layers. These thin films provide excellent moisture and oxygen blocking properties while maintaining minimal thickness. The flexible organic layers also allow the encapsulation structure to conform to device contours without adding significant bulk, thus improving blocking performance without increasing device thickness.