OLED Encapsulation Package with Moisture Sensitive Layer
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Solution Overview
Problem
Current OLED encapsulation methods, such as glass adhesive packaging, face challenges like bubble formation, leakage, and difficulty in detecting moisture intrusion, which can lead to device failure and reduced yield, especially due to the transparent and small nature of leakage points.
Innovation Solution
Incorporating a moisture sensitive layer within the encapsulation unit that discolors upon water contact, allowing for easy detection of moisture intrusion and facilitating analysis and repair, with a layered structure comprising a first sealing layer, a moisture sensitive layer, and a second sealing layer, and optionally a third sealing layer, to enhance packaging and sealing efficacy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass adhesive packaging is used for OLED encapsulation, then sealing efficacy is improved, but detection of moisture intrusion becomes difficult due to transparent and small leakage points
Solution Approach 1:
The patent applies color change principle by incorporating a moisture-sensitive layer containing discoloration agents (such as cobalt chloride, copper sulfate, or calcium oxide) that change color when exposed to moisture. This allows visual detection of moisture intrusion through color transformation from blue to pink or from white to blue, solving the detection difficulty while maintaining the reliable sealing of glass adhesive packaging.
Solution Approach 2:
The moisture-sensitive layer acts as an intermediary between the sealed encapsulation space and the external environment. It is positioned within the encapsulation structure to detect moisture that penetrates through the sealing layers, serving as a mediator that translates invisible moisture presence into visible color changes for easy detection.
2Reliability
If encapsulation packaging is used for OLED, then device protection is improved, but bubble formation and leakage issues worsen
Solution Approach 1:
The encapsulation structure is segmented into multiple functional layers: a first sealing layer (glass adhesive), a moisture-sensitive layer, and a second sealing layer (resin adhesive). This segmentation allows each layer to perform its specific function - the glass adhesive provides robust sealing, the moisture-sensitive layer detects issues, and the resin adhesive provides flexibility and additional sealing, thereby reducing bubble formation and leakage while maintaining protection.
Solution Approach 2:
The patent employs composite materials by combining different sealing materials with distinct properties. The glass adhesive offers strong bonding and sealing, while the resin adhesive provides flexibility and gap-filling capabilities. This composite approach balances the rigidity needed for sealing with the flexibility needed to prevent bubbles and leakage, improving overall encapsulation reliability.
3Difficulty of detecting and measuring
If moisture sensitive layer is added to encapsulation unit, then moisture intrusion detection is improved, but device complexity increases
Solution Approach 1:
The moisture-sensitive layer provides self-service detection functionality within the encapsulation structure. It automatically detects and indicates moisture intrusion through color change without requiring external detection equipment or complex monitoring systems. This simple yet effective approach improves detection capability while adding minimal complexity to the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The moisture sensitive layer enables straightforward detection of moisture intrusion, allowing for timely analysis and repair, thereby improving product yield and extending device lifetime by ensuring effective sealing and preventing corrosion damage.
Implementation Method 1
the moisture sensitive layer is capable of discoloring upon encountering with water
Data Source
AI summary
An OLED encapsulation package, a display device and a packaging method are disclosed. The OLED encapsulation package includes a substrate, a cover board and a encapsulation unit located between the substrate and the cover board; the substrate is provided with display components thereon, and the encapsulation unit encapsulates the periphery of the display components; the encapsulation unit includes at least a moisture sensitive layer therein, and the moisture sensitive layer is capable of discoloring upon encountering with water.