OLED Encapsulation Composition for Moisture Barrier and Out-Gas Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Organic electronic devices, particularly OLEDs, face challenges in sealing materials that must be colorless and transparent to prevent moisture and oxygen ingress, while maintaining optical properties and processability, especially for top-emitting structures.
Innovation Solution
A pressure-sensitive adhesive composition comprising a curable compound, thermal initiator, and hardening retarder, with specific weight ratios, is applied to encapsulate organic electronic elements, ensuring thermal stability, optical properties, and processability, including a uniform coating film and effective out-gas suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing material is used to encapsulate the OLED element, then moisture and oxygen ingress is blocked, but the sealing material must be colorless and transparent which limits material selection and may compromise protective performance
Solution Approach 1:
The patent changes the chemical composition parameters of the sealing material by using a curable compound system with specific ratios of epoxy resin, phenolic resin, and curing agent. This allows the material to be colorless and transparent while achieving superior protective performance through controlled crosslinking density and network structure.
Solution Approach 2:
The patent employs a composite sealing material comprising multiple resin components (epoxy resin and phenolic resin) combined with a curing agent. This composite structure integrates the advantages of each component: epoxy resin provides adhesion and flexibility, phenolic resin contributes to heat resistance and dimensional stability, and the combination achieves both transparency and enhanced protective properties.
2Manufacturing precision
If the sealing material has low viscosity for uniform coating in ODF process, then coating uniformity is improved, but the material may not provide sufficient protective performance
Solution Approach 1:
The patent optimizes the viscosity parameter of the sealing material by adjusting the molecular weight and structure of the epoxy resin and phenolic resin components. The low viscosity enables uniform coating in the ODF process, while the specific chemical composition ensures adequate protective performance after curing.
Solution Approach 2:
The patent performs preliminary formulation of the sealing material composition before the coating process, ensuring that the material has the appropriate viscosity for uniform application. The pre-mixed composition of curable compound, thermal initiator, and hardening retarder is prepared to achieve both processability and protective performance.
3Reliability
If the sealing material is cured at high temperature to improve crosslinking density, then protective performance is enhanced, but out-gas may cause physical and chemical damage to organic electronic elements
Solution Approach 1:
The patent introduces a hardening retarder as an intermediary substance that mediates the curing process. This additive controls the reaction rate, allowing the crosslinking to proceed at moderate temperatures while minimizing out-gas generation. The hardening retarder acts as a buffer that prevents excessive gas evolution during curing.
Solution Approach 2:
The patent modifies the curing temperature parameter by using a controlled curing process with thermal initiator and hardening retarder. Instead of high-temperature curing that causes out-gas, the system achieves adequate crosslinking density at lower temperatures through controlled chemical reaction kinetics.
4Ease of manufacture
If the sealing material has long pot life for processability, then coating time is extended, but the material may not cure properly or provide sufficient protection
Solution Approach 1:
The patent uses a hardening retarder as an intermediary that temporarily inhibits the curing reaction, extending the pot life for processing. This additive allows sufficient time for coating operations while ensuring that the material will eventually cure completely to provide the required protective performance.
Solution Approach 2:
The patent performs preliminary preparation of the sealing material composition with controlled formulation to achieve the desired balance between pot life and curing performance. The thermal initiator and hardening retarder are pre-combined in specific ratios to ensure both processability and complete curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively blocks moisture and oxygen, enhancing the lifespan of organic electronic devices, preventing physical and chemical damage, while maintaining excellent optical properties and processability, even at high temperatures.
Implementation Method 1
a curable compound; a thermal initiator; and a hardening retarder
Implementation Method 2
capable of suppressing deterioration due to out-gas... effectively blocking moisture or oxygen introduced from the outside
Implementation Method 3
curable compound... thermal initiator... hardening retarder
Data Source
Figure 1
AI summary
Provided is a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and an encapsulating composition that can form a structure capable of effectively blocking moisture or oxygen introduced from the outside into an organic electronic device, thereby securing a lifetime of the organic electronic device, and that can be applied to a top-emitting organic electronic device to prevent physical and chemical damage of organic electronic elements, while having excellent optical properties and processability, and an organic electronic device comprising the same.