OLED Panel Encapsulation Layout Against Spacer-Induced Cracks

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Solution Overview

Problem

In the manufacturing of OLED display panels, the evaporation process for forming a light-emitting layer is hindered by the contact between the mask and the backplane, leading to potential scratches and cracks in the encapsulation layer due to spacer foreign matter, which compromises the panel's integrity and reliability.

Innovation Solution

The display panel design includes a spacer arrangement where the first spacers are positioned at the inner side of the second encapsulation layer boundary, with the second encapsulation layer acting as a buffer to prevent puncturing of the inorganic encapsulation layer, thereby enhancing the encapsulation structure's integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the mask contacts the backplane during evaporation process, then the manufacturing process is simplified, but scratches and cracks occur in the encapsulation layer due to spacer foreign matter

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidencapsulation layer integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces a buffer layer as an intermediary between the inorganic encapsulation layer and the spacer foreign matter. This buffer layer absorbs the mechanical stress and prevents direct contact between the spacer and the inorganic encapsulation layer, thereby preventing scratches and cracks while maintaining the protective function of the encapsulation structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The buffer layer is deposited beforehand on the inorganic encapsulation layer to provide cushioning protection against potential damage from spacer foreign matter during the evaporation process. This prior cushioning measure ensures that even if spacer particles are present, they cannot cause scratches or cracks in the underlying encapsulation layer.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Device complexity

If spacer foreign matter is present during evaporation, then the manufacturing process is simpler, but cracks occur in the encapsulation layer compromising integrity

Engineering Contradiction:
Improveprocess complexityVSAvoidencapsulation layer strength
Core Design Contradiction:
Device complexityVSStrength

Solution Approach 1:

The buffer layer is deposited beforehand on the inorganic encapsulation layer to provide cushioning protection against potential damage from spacer foreign matter during the evaporation process. This prior cushioning measure ensures that even if spacer particles are present, they cannot cause scratches or cracks in the underlying encapsulation layer.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The buffer layer acts as an intermediary layer that mediates between the spacer foreign matter and the inorganic encapsulation layer. It absorbs the mechanical impact and prevents direct damage, thereby maintaining the strength and integrity of the encapsulation layer despite the presence of spacer particles.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Area of stationary object

If the second encapsulation layer boundary is positioned at the outer side of the spacer, then the encapsulation coverage is maximized, but the inorganic encapsulation layer is vulnerable to puncturing

Engineering Contradiction:
Improveencapsulation coverage areaVSAvoidencapsulation layer protection
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The buffer layer serves as an intermediary protective layer between the inorganic encapsulation layer and the spacer foreign matter. It absorbs mechanical stress and prevents direct contact, thereby protecting the inorganic encapsulation layer from puncturing while allowing the second encapsulation layer boundary to extend to the outer side of the spacer for maximum coverage.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs a composite encapsulation structure combining organic and inorganic materials. The buffer layer (organic material) provides mechanical cushioning and protection against puncturing, while the inorganic encapsulation layer provides barrier properties. This composite structure achieves both comprehensive coverage and enhanced protection.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS12610692B2Display panel and display device
Publication Date: 2026.04.21 CHENGDU BOE OPTOELECTRONICS TECH CO LTD
  • US12610692B2 patent drawing
  • US12610692B2 patent drawing
  • US12610692B2 patent drawing

AI summary

A display panel and a display device are provided. The display panel includes: a plurality of sub-pixels disposed in a display region; at least one dam disposed in the peripheral region; a first electrode layer disposed on the base substrate; a pixel defining layer a spacer layer and an encapsulation structure including a first encapsulation layer, a second encapsulation layer and a third encapsulation layer. A plurality of spacers are located in the spacer layer. Among the spacers, a first spacer is located in the peripheral region, and is located at a position farthest away from a center of the display region. An orthographic projection of a boundary of the second encapsulation layer is located on a side of an orthographic projection of at least one dam, and an orthographic projection of the first spacer is located on a side of the orthographic projection of the boundary.