OLED Encapsulation Stress Distribution via Multi-Layer Films
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
OLED devices are prone to degradation and failure due to moisture and oxygen exposure, leading to shortened service life and mechanical weaknesses during handling and testing, as existing encapsulation methods fail to adequately protect the sensitive organic materials and electrodes.
Innovation Solution
A method for manufacturing OLED devices involving the formation of inorganic films by CVD or ALD, followed by an organic film, and a protective layer to seal and strengthen the devices, with a cutting procedure to isolate units, enhancing mechanical strength and preventing scratching and crushing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulation is performed by cover plate glass with Frit, then the device is protected from moisture and oxygen, but stress concentration occurs during falling tests causing frequent breakage of the paralleled long edge
Solution Approach 1:
The encapsulation structure is divided into multiple layers: a first inorganic film layer, an organic film layer, and a second inorganic film layer. This segmented multi-layer structure distributes stress more evenly compared to the single-layer glass encapsulation, preventing stress concentration at specific edges while maintaining protective functionality.
Solution Approach 2:
The patent uses composite material structure combining organic and inorganic films for encapsulation. The organic film provides flexibility and stress distribution, while the inorganic films provide barrier properties. This composite approach maintains protection from moisture and oxygen while improving mechanical strength during handling and falling tests.
2Reliability
If multiple thin films are formed to encapsulate OLED units, then protection from moisture and oxygen is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The manufacturing process merges multiple film formation steps into a coordinated sequence using complementary deposition techniques. The inorganic films are formed by CVD or ALD, the organic film by ink-jet printing or evaporation, and these processes are integrated into a unified manufacturing flow that achieves effective encapsulation while managing process complexity.
Solution Approach 2:
The patent employs different deposition parameters and techniques for different film layers. By adjusting deposition conditions (temperature, pressure, material composition) for each layer, the process optimizes both protective performance and manufacturability, allowing complex multi-layer structures to be produced through controlled parameter variations rather than fundamentally different processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly increases the mechanical strength and quality of OLED devices by absorbing stress and protecting the encapsulated films, thereby extending service life and ensuring stable operation.
Implementation Method 1
The inorganic material film covers the upper surfaces of the OLED units to absorb the stress
Implementation Method 2
The first inorganic film and the second inorganic film are formed by chemical vapor deposition (CVD) or atomic layer deposition (ALD)
Implementation Method 3
The first inorganic film and the second inorganic film are formed by chemical vapor deposition (CVD) or atomic layer deposition (ALD)
Data Source
AI summary
The present invention relates to a display technology field, in specifically, to a method for manufacturing an OLED. The organic material film and inorganic material film are formed on the upper surface of the OLED devices, the inorganic material film covers over the organic material film to absorb the stress, and a protective layer is formed on the inorganic material film in prior to the cutting procedure to protect the encapsulated film from scratching and crushing, so that the mechanical strength of the whole OLED devices is increased, the quality of the display is improved.


