OLED Encapsulation Substrate with Integrated Filling Dams
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Solution Overview
Problem
Organic light emitting diode (OLED) display devices face challenges due to the vulnerability of organic thin films to moisture and oxygen, which degrade the performance of the negative electrode and require effective encapsulation to prevent invasion, while existing encapsulation substrates have weak mechanical strength and complex fabrication processes.
Innovation Solution
The use of an encapsulation substrate with an encapsulation agent, such as glass frit, and filling dams formed of the same material, integrated to enhance mechanical strength and simplify the fabrication process by forming inner and outer dams within the encapsulation region, allowing for effective sealing and protection against external impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass frit is used as encapsulation agent, then moisture and oxygen barrier is improved, but mechanical strength is insufficient
Solution Approach 1:
The patent combines glass frit with inorganic particles (such as aluminum oxide, silicon oxide, or boron oxide) to create a composite encapsulation material. This composite structure maintains the excellent moisture and oxygen barrier properties of glass frit while the inorganic particles provide enhanced mechanical strength and structural stability, resolving the contradiction between barrier performance and mechanical strength.
2Reliability
If separate inner dam and outer dam structures are used, then encapsulation reliability is improved, but fabrication process complexity increases
Solution Approach 1:
The patent merges the inner dam and outer dam into a single integrated dam structure formed by one continuous coating and firing process. This unified dam structure contains both the inner and outer boundary regions, simplifying the fabrication process while maintaining the dual-functionality of preventing encapsulation agent overflow and providing structural support, thus resolving the contradiction between encapsulation reliability and process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced mechanical strength and a simplified fabrication process for OLED display devices, effectively preventing moisture and oxygen invasion while maintaining the advantages of OLED technology, such as low power consumption and wide viewing angles.
Implementation Method 1
The encapsulation agent may be a glass frit, which may be formed of one selected from the group consisting of lead oxide (PbO), diboron trioxide (B2O8), and silicon dioxide (SiO2)
Data Source
AI summary
An organic light emitting diode (OLED) display device and method of fabrication that includes a substrate having a device region, an outer dam region and an encapsulation region. The encapsulation region includes an inner dam region, an outer dam region and an encapsulation region that correspond to the device region. An encapsulation agent is formed in the encapsulation region of the encapsulation substrate, and filling dams are formed of the same material in the outer dam region and the inner dam region of the encapsulation substrate.