Reusable OLED Encapsulation Support Plate with Porous Vacuum Adsorption
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Solution Overview
Problem
Current encapsulation methods for OLED substrates using adhesive tape or glue result in uneven stress distribution, potential damage, and pollution, leading to fabrication challenges and increased costs due to waste and inefficiencies in the encapsulation process.
Innovation Solution
A reusable encapsulation layer support plate with a porous material-filled cavity and a rubber membrane, allowing for pressure-driven adsorption of the encapsulation layer without glue or tape, enabling flexible design and large-scale encapsulation while avoiding substrate damage and pollution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive tape or glue is used to attach the encapsulation layer on the support plate, then the encapsulation layer can be fixed for encapsulation, but the attached area becomes thicker, causing uneven stress distribution that leads to substrate damage and pollution
Solution Approach 1:
The invention extracts and eliminates the adhesive tape or glue from the encapsulation process. Instead of using adhesive materials to attach the encapsulation layer to the support plate, the patent uses a vacuum fixation method where the encapsulation layer is held in place by atmospheric pressure differential created during vacuum deposition. This removes the harmful adhesive materials that cause substrate damage and pollution while maintaining reliable attachment during the encapsulation process.
Solution Approach 2:
The invention replaces the mechanical adhesive bonding system with a physical pressure-based fixation system. During vacuum deposition, the support plate creates a pressure differential that presses the encapsulation layer against the substrate without requiring adhesive materials. This mechanical substitution eliminates the chemical and physical harm caused by adhesives while maintaining secure attachment throughout the encapsulation process.
2Reliability
If adhesive tape or glue is used to attach the encapsulation layer, then the encapsulation layer can be fixed, but the glue may result in pollution in the operation chamber and variation of water oxygen value
Solution Approach 1:
The invention extracts and eliminates adhesive materials from the encapsulation process. By using vacuum fixation through pressure differential instead of adhesive tape or glue, the patent removes the source of pollution in the operation chamber and prevents variation in water oxygen value that would otherwise be caused by adhesive materials during the encapsulation process.
3Reliability
If the encapsulation layer is attached with adhesive tape, then it can be fixed for encapsulation, but it is easy to form a step at the edge positions and difficult to attach uniformly and smoothly
Solution Approach 1:
The invention replaces the adhesive-based mechanical fixation system with a uniform pressure distribution system. During vacuum deposition, atmospheric pressure acts uniformly across the entire encapsulation layer surface, pressing it smoothly against the substrate without creating localized thickness variations or steps at edge positions. This results in uniform and smooth attachment throughout the encapsulation process.
4Reliability
If adhesive tape or glue is used to attach the encapsulation layer, then the encapsulation layer can be fixed, but applying pressure may crush the OLED substrate
Solution Approach 1:
The invention extracts and eliminates adhesive materials that create localized stress concentrations. By using uniform atmospheric pressure differential during vacuum deposition instead of adhesive tape or glue, the patent distributes pressure evenly across the encapsulation layer and substrate, preventing localized stress points that would otherwise crush or damage the fragile OLED substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents substrate damage, reduces fabrication costs by reusing the encapsulation layer support plate, and facilitates uniform encapsulation with reduced waste and pollution, enhancing the encapsulation process efficiency.
Implementation Method 1
By arranging the porous material within the support plate body, the pressure difference before and after decompression can be used to realize good adsorption of the encapsulation layer
Implementation Method 2
the pressure difference before and after decompression can be used to realize good adsorption of the encapsulation layer
Implementation Method 3
the holes in the porous material discharges the internal air after decompression; if the ambient pressure is recovered to atmosphere pressure, the ambient pressure will push the encapsulation layer
Data Source
AI summary
The embodiments of the present invention disclose a reusable encapsulation layer support plate comprising: a support plate body, the top of the support plate body being arranged with at least one first opening for accommodating an encapsulation layer; a cavity arranged within the support plate body, the cavity being filled with a porous material, and the top of the cavity having at least one second opening; wherein the first opening is connected with and arranged opposite to the second opening, and the top surface of the porous material is parallel and level with the bottom surface of the first opening. The encapsulation layer support plate can avoid crash of OLED substrate, realize effective OLED encapsulation, and can be reused as far as possible. The embodiments of the present invention further disclose a method of encapsulating an OLED substrate using the encapsulation layer support plate.