Flexible Base Groove for OLED Circuit Connection Stress Relief
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In narrow frame OLED products, the bending of the circuit connection area during manufacturing causes structural stress, leading to potential damage or breakage due to high tensile stress from the back film, which is required to have strong adhesive properties.
Innovation Solution
A display substrate with a flexible base featuring a groove on its lower surface, corresponding to the circuit connection area, which reduces structural stress and facilitates easier bending by allowing the back film to be partially detached, and a through groove in the back film for easier removal, enabling a more accurate and simpler cutting process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the back film is made with high adhesive force for protection, then the protective function is improved, but the tensile stress during bending increases causing circuit connection area damage
Solution Approach 1:
The back film is segmented by introducing a removal groove that divides it into separate regions. This allows the back film to maintain high adhesive force in protective areas while creating a stress-relief zone in the groove area that prevents tensile stress from propagating to the circuit connection area during bending.
Solution Approach 2:
The harmful adhesive bonding is extracted or removed in the groove region. By creating a removal groove, the back film is intentionally detached in specific areas where its adhesive force would otherwise create damaging tensile stress during bending, while maintaining protection in other areas.
2Area of stationary object
If the circuit connection area is bent to the back surface for narrow frame design, then the structural size is reduced, but the tensile stress causes breaking or damage
Solution Approach 1:
The flexible base is segmented by introducing a bending groove that divides it into a bending portion and a connection portion. This segmentation allows the bending portion to be flexed for narrow frame design while the connection portion remains stable and protected from damage.
Solution Approach 2:
The harmful structural continuity is extracted or removed in the groove region. By creating a bending groove, the rigid connection is interrupted in the bending area, allowing the circuit connection area to be bent to the back surface without transmitting damaging tensile stress to the connection portion.
3Reliability
If the back film is fully bonded for protection, then the protective function is improved, but the removal process becomes complex and time-consuming
Solution Approach 1:
The back film is segmented by introducing a removal groove that divides it into separate regions. This segmentation allows the back film to maintain high adhesive force in protective areas while creating a stress-relief zone in the groove area that prevents tensile stress from propagating to the circuit connection area during bending.
Solution Approach 2:
The harmful adhesive bonding is extracted or removed in the groove region. By creating a removal groove, the back film is intentionally detached in specific areas where its adhesive force would otherwise create damaging tensile stress during bending, while maintaining protection in other areas.
Data Source
AI summary
A display substrate and a preparation method thereof, a display device and a preparation method thereof and a display apparatus are proposed in the disclosure. The preparation method of the display substrate includes: providing a flexible base, an upper surface thereof having a display area and a circuit connection area, and a portion of the flexible base including a bending portion and a connection portion; disposing a groove on the lower surface, and an orthographic projection of the groove on the upper surface corresponding to a position of an orthographic projection of the bending portion on the upper surface; disposing a back plate, an OLED light emitting device and a package structure in a sequence on the display area, and disposing a circuit connection layer on the circuit connection area. Bending the bending portion downward to extend, the connection portion is located on a side of the lower surface.