OLED Fluorinated Epoxy Sealing for Moisture Barrier

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Solution Overview

Problem

Existing OLED devices face challenges in maintaining longevity due to moisture and oxygen penetration, especially in high-temperature and high-humidity environments, which affects their reliability and contamination levels.

Innovation Solution

The use of a fluorinated epoxy sealing material with an inorganic layer, applied through either thin film or can-type encapsulation methods, provides enhanced water-proofing and protection for the OLED device, including a primer layer for improved adhesion and a choice of materials like silicon nitride or glass for the encapsulation substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional sealing materials are used in OLED devices, then the device structure is simple and manufacturing is easier, but the device lifespan is reduced due to moisture and oxygen penetration in high-temperature and high-humidity environments

Engineering Contradiction:
Improvedevice lifespanVSAvoidsealing structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs a composite sealing structure consisting of an inorganic layer (silicon oxide, silicon nitride, or aluminum oxide) combined with an organic sealing material (epoxy resin or polyimide). This composite approach leverages the moisture and oxygen barrier properties of inorganic materials while utilizing the adhesive and sealing capabilities of organic materials, thereby significantly improving device lifespan against environmental degradation without excessive structural complexity

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent utilizes thin film encapsulation layers with controlled thickness (inorganic layer: 50-200 nm, organic layer: 1-5 μm) to provide effective barrier protection against moisture and oxygen penetration. These thin films achieve reliable sealing while maintaining device compactness and minimizing the impact on device lifespan

Inventive Principle:
Principle #30Flexible shells and thin films

2Reliability

If conventional sealing materials are used in OLED devices, then the manufacturing process is simpler, but contamination increases due to insufficient water-proofing ability in high-temperature and high-humidity environments

Engineering Contradiction:
Improvecontamination resistanceVSAvoidsealing process complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent optimizes the thickness parameters of sealing layers (inorganic layer: 50-200 nm, organic layer: 1-5 μm) to achieve the optimal balance between barrier performance and manufacturing feasibility. By controlling these dimensional parameters, the patent enhances contamination resistance through improved water-proofing ability while maintaining ease of manufacture within standard fabrication capabilities

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies sealing materials and forms encapsulation structures before the OLED device is exposed to high-temperature and high-humidity environments during operation or testing. This preliminary encapsulation prevents moisture and oxygen from reaching the organic light-emitting layers, thereby minimizing contamination from the outset rather than addressing it after damage occurs

Inventive Principle:
Principle #10Preliminary action

3Object-affected harmful factors

If thicker sealing layers are used to improve water-proofing, then moisture and oxygen penetration is reduced, but the device size and structural complexity increase

Engineering Contradiction:
Improvemoisture and oxygen penetrationVSAvoidsealing layer thickness
Core Design Contradiction:
Object-affected harmful factorsVSLength of stationary object

Solution Approach 1:

The patent employs a composite sealing structure consisting of an inorganic layer (silicon oxide, silicon nitride, or aluminum oxide) combined with an organic sealing material (epoxy resin or polyimide). This composite approach leverages the moisture and oxygen barrier properties of inorganic materials while utilizing the adhesive and sealing capabilities of organic materials, thereby significantly improving device lifespan against environmental degradation without excessive structural complexity

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent utilizes thin film encapsulation layers with controlled thickness (inorganic layer: 50-200 nm, organic layer: 1-5 μm) to provide effective barrier protection against moisture and oxygen penetration. These thin films achieve reliable sealing while maintaining device compactness and minimizing the impact on device lifespan

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution significantly improves the lifespan of OLED devices by minimizing contamination and ensuring effective sealing against moisture and oxygen, applicable to both small and large-area displays.

Implementation Method 1

The sealing member includes a fluorinated epoxy sealing material including a fluorinated epoxy resin

Methodology Applied
Scientific EffectHydrophobe: Hydrophobe

Implementation Method 2

The inorganic layer may include an inorganic material of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, silicon oxynitride (SiON), or combinations thereof

Methodology Applied
Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Data Source

PatentUS8624230B2Organic light emitting diode display
Publication Date: 2014.01.07 SAMSUNG DISPLAY CO LTD
  • US8624230B2 patent drawing
  • US8624230B2 patent drawing
  • US8624230B2 patent drawing

AI summary

Disclosed is an organic light emitting diode (OLED) device, which includes: an organic light emitting diode including a first electrode, a second electrode, and an emission layer interposed between the first electrode and the second electrode; a base substrate supporting the organic light emitting diode; and a sealing member disposed on the base substrate while covering the organic light emitting diode. Herein, the sealing member includes a fluorinated epoxy sealing material including a fluorinated epoxy resin.