Flexible OLED Module Thickness Reduction via Foam Layer Substitution
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Solution Overview
Problem
Conventional flexible OLED module stacked structures require a two-segment back plate structure, leading to increased bonding difficulty, higher material costs, and ash generation during laser cutting, which results in a thicker product that does not meet current thinness trends.
Innovation Solution
A flexible OLED module stacked structure that replaces the back plate with a protective film and a foam layer, comprising a substrate with a thin film transistor array, an OLED element layer, a thin film encapsulation layer, a cover plate, and an optically clear adhesive for bonding, along with a foam layer made of foam, copper, and graphite, which supports and protects the substrate, reducing thickness and bonding challenges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a back plate is used to support and protect the substrate during manufacturing, then the substrate is protected and supported, but the overall thickness of the OLED module increases and material costs increase
Solution Approach 1:
The patent removes the traditional back plate component from the OLED module structure. Instead of using a separate back plate for substrate support and protection, the substrate itself is designed to serve these functions directly, eliminating the additional thickness and material cost associated with a dedicated back plate while maintaining the necessary protection and support during manufacturing and operation
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: it serves as both the structural support base and the protective layer for the OLED elements. By making the substrate multi-functional, the patent eliminates the need for a separate back plate, thereby reducing overall module thickness while maintaining reliability
2Ease of operation
If a two-segment back plate structure is adopted to accommodate bonding pad bending, then the bonding pad can be bent properly, but more ash is generated during laser cutting through the air layer
Solution Approach 1:
The patent eliminates the two-segment back plate structure with its air layer by using a unified substrate design. The substrate continuously supports the bonding pads throughout their length, allowing proper bending without creating air gaps that would generate ash during laser cutting processes
Solution Approach 2:
The substrate is designed with locally optimized properties in different regions to accommodate bonding pad bending requirements while maintaining a continuous structure. This allows the bonding pads to be bent properly in specific areas without requiring a segmented back plate structure that would create air layers and ash generation issues
3Strength
If a thick back plate structure is used, then the substrate is well-supported, but the OLED product thickness increases and does not meet current thinness trends
Solution Approach 1:
The patent removes the thick back plate structure entirely and relies on the substrate's inherent mechanical properties and optimized design to provide necessary support. This extraction of the back plate component directly reduces the overall product thickness to meet current thinness trends while maintaining adequate substrate support through alternative design approaches
Solution Approach 2:
The substrate's physical and mechanical parameters are optimized to provide sufficient support strength without requiring additional thick back plate structures. By changing the substrate's material properties, thickness, or structural characteristics, the patent achieves the necessary support function with minimal overall product thickness
Data Source
AI summary
The present invention provides a flexible organic light emitting diode (OLED) module stacked structure and a manufacturing method of the flexible OLED module stacked structure. The structure includes a substrate, a thin film transistor (TFT) array layer, an OLED element layer, a thin film encapsulation layer, a cover plate, and a foam layer. The thin film encapsulation layer is disposed on the OLED element layer, and entirely covers the OLED element layer. The foam layer is disposed on one side of the substrate away from the TFT array layer. The protective film in place of a back plate is used and removed, and the foam layer is used to provide a support and buffering function, so an overall thickness is reduced, and less ash is produced.