OLED Frame Snap Fit Elastic Sheet Heat Dissipation
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Solution Overview
Problem
Organic EL display devices face issues with structural reliability due to adhesive deterioration, low assembly precision, increased thickness and size for rigidity, and impact resistance, particularly with bottom emission methods and flexible printed circuit connections.
Innovation Solution
A frame structure with a snap fit design, elastic sheets for heat diffusion, and support springs to prevent positional deviation and enhance impact resistance, combined with a truss structure for increased rigidity and a special heat transfer film for efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive is used to fix double-faced tape to OLED element, then fixing is achieved, but adhesive deteriorates with time due to heat generation causing reliability problems
Solution Approach 1:
The patent removes the adhesive layer from the bonding system entirely. Instead of using adhesive to attach the double-faced tape to the OLED element, the invention uses a mechanical pressing method where the upper frame is pressed down to secure the bonding, eliminating the thermal degradation issue of adhesives while maintaining reliable fixing.
2Ease of manufacture
If circular dowels are used for engagement assembly of upper and lower frames, then assembly is simplified, but assembly precision and rigidity are low due to slip in engagement portions
Solution Approach 1:
The patent divides the single circular dowel into multiple smaller protrusions (first and second protrusions) distributed around the bonding area. This segmentation provides multiple contact points that prevent slipping while maintaining ease of assembly, thereby improving both assembly precision and structural rigidity.
3Strength
If resin mold is used to fix OLED element, then rigidity is improved, but display element becomes thicker and external size becomes larger
Solution Approach 1:
The patent replaces the thick resin mold with a thin double-faced tape bonded to the OLED element. This thin film approach provides sufficient rigidity support while maintaining a compact thickness profile, avoiding the bulky structure that would result from using a resin mold.
4Ease of operation
If FPC connection terminals are placed on reverse side of light emitting surface, then connection is achieved, but flat cables bend in peeling direction when connected to driving circuit
Solution Approach 1:
The patent incorporates an elastic sheet between the OLED element and the upper frame that acts as a cushioning layer. This elastic sheet absorbs and distributes the stress from cable bending, preventing the peeling force from concentrating at the FPC connection points, thereby maintaining connection reliability despite the reverse-side terminal configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances the structural reliability, assembly precision, and impact resistance of OLEDs while maintaining thin and lightweight designs, ensuring reliable connections and efficient heat dissipation.
Implementation Method 1
By providing the elastic sheet with a function such as heat diffusion, the reliability of the OLED element can be increased
Implementation Method 2
a lower frame and an upper frame are provided with an engagement structure (snap fit) having a notch shape to prevent positional deviation in the thickness direction after assembly
Implementation Method 3
A frame structure with a snap fit design, elastic sheets for heat diffusion, and support springs to prevent positional deviation and enhance impact resistance
Implementation Method 4
combined with a truss structure for increased rigidity
Implementation Method 5
a special heat transfer film for efficient cooling
Data Source
AI summary
The strength of the whole OLED is increased by proposing a new method of fixing OLED panels. To address the problem, an OLED element is formed on a substrate, and a sealing substrate of a structure by which the substrate is sealed is fixed to a lower metallic frame via an elastic sheet. Silicon resin is preferably used as the sheet, and use of a sheet having a heat diffusion function based on radiation is more desirable.