OLED Encapsulation Frit with Electrode Openings
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Solution Overview
Problem
Existing organic light-emitting display devices face challenges in preventing oxygen and moisture infiltration, which degrades the organic light-emitting diodes, particularly due to the oxidation of metal cathode electrodes, and current moisture-absorbing methods complicate manufacturing, increase costs, and are not suitable for mass production or front-light emitting configurations.
Innovation Solution
The use of a frit, formed from glass powder with added oxide and organic matter, is applied between substrates to encapsulate the pixel region, with openings in the electrode lines to reduce laser-induced overheating and improve adhesion, allowing for effective sealing and protection from moisture and oxygen while minimizing process complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If moisture absorbent material is mounted in powder form, then moisture removal capability is improved, but process complexity and manufacturing cost increase
Solution Approach 1:
The patent changes the physical form of the moisture absorbent material from powder to film, and integrates it with the sealing structure. The film form factor allows for uniform thickness control, easier handling, and integration with the encapsulation process, thereby reducing manufacturing complexity while maintaining moisture absorption effectiveness.
Solution Approach 2:
The patent creates a composite structure by integrating the moisture absorbent film with the sealing layer or encapsulation structure. This composite approach allows the sealing and moisture absorption functions to be combined in a single integrated component, reducing the number of separate materials and processes needed.
2Ease of manufacture
If moisture absorbent material is adhered as film, then ease of manufacture is improved, but moisture removal capability and durability decrease
Solution Approach 1:
The patent optimizes the film thickness and material composition parameters to achieve the right balance between ease of manufacture and effectiveness. By controlling the film thickness within a specific range and selecting appropriate absorbent materials, the patent maintains high moisture removal capability while preserving the ease of film application and integration.
3Reliability
If frit is used for encapsulation, then sealing effectiveness is improved, but laser-induced overheating occurs at electrode line intersections
Solution Approach 1:
The patent segments the electrode lines by forming openings or gaps at the intersection regions where they cross the frit. This segmentation prevents the laser energy from being concentrated at the intersection points, thereby reducing overheating while maintaining the sealing effectiveness of the frit encapsulation.
Solution Approach 2:
The patent extracts or removes material from the electrode lines at intersection regions to create openings. This extraction eliminates the problematic intersection points that cause laser-induced overheating, while the frit continues to provide effective sealing around the pixel region.
4Temperature
If openings are formed in electrode lines, then laser-induced overheating is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by forming openings only at specific intersection regions of electrode lines, rather than uniformly across all electrode lines. This localized approach targets the specific problem areas causing overheating while minimizing the impact on overall manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents oxygen and moisture infiltration, maintains the electrical and light-emitting characteristics of the organic light-emitting diodes, and simplifies the manufacturing process, making it suitable for mass production and front-light emitting configurations.
Implementation Method 1
a first substrate of an organic light-emitting display device and a second substrate opposed and bonded to the first substrate with sealant for encapsulation
Implementation Method 2
In the intersecting region of the frit and the electrode line, at least one opening is formed in the electrode line
Data Source
Figure 1~2B
Figure 3
Figure 4~5
AI summary
An organic light-emitting display device encapsulated with a frit to prevent an infiltration of oxygen and moisture thereinto. The device comprises: a first substrate comprising a pixel region wherein a pixel is formed and a non-pixel region outside of the pixel region; a second substrate opposed and bonded to the first substrate in one region comprising the pixel region; a frit positioned in the non-pixel region between the first substrate and the second substrate, to bond the first substrate and the second substrate; and at least one electrode line formed on the first substrate and overlapped with a portion of the frit, wherein the electrode line comprises at least one opening in an intersecting region overlapped with the frit.