Transparent Conductive Layer for Laser Welding OLED Frit Sealing
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Solution Overview
Problem
The existing UV curable sealants in organic electro-luminescent device packages are insufficient in blocking water and oxygen, and the use of laser frits is limited by the need for transparent paths for laser welding, which can be obstructed by non-transparent metal conductive wires, leading to incomplete welding and reduced device reliability.
Innovation Solution
An organic electro-luminescent device package with a transparent conductive layer on the cover substrate allows a laser beam to pass through, enabling effective laser welding of a frit between the substrates, thereby ensuring reliable sealing without obstructing the laser beam, using a frit made of organic material with oxide particles that can be irradiated with wavelengths between 800 nm to 1000 nm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If UV curable sealant is used to seal the organic electro-luminescent device package, then the sealing process is simple and fast, but the sealing performance against water and oxygen is insufficient
Solution Approach 1:
The patent uses a composite frit material comprising inorganic glass particles and organic binder, which combines the advantages of both materials. The inorganic glass particles provide excellent sealing performance and laser weldability, while the organic binder ensures proper adhesion and processing. This composite structure resolves the contradiction by achieving both good sealing performance and ease of manufacture through laser welding.
2Reliability
If laser frit is used to ensure reliable sealing and water/oxygen blocking, then sealing performance is improved, but the process becomes restricted by the need for transparent paths for laser welding
Solution Approach 1:
The patent modifies the optical parameters of the conductive layer by using transparent conductive oxides instead of traditional non-transparent metal conductors. This parameter change allows the laser beam to pass through the conductive layer and reach the frit for welding, thereby maintaining both reliable sealing and process flexibility. The transparent conductive oxide layer has sufficient electrical conductivity while being transparent to the laser wavelength used.
3Quantity of substance
If non-transparent metal conductive wires are used for signal transmission, then electrical conductivity is achieved, but the laser beam is blocked leading to incomplete laser welding
Solution Approach 1:
The patent changes the optical parameter of the conductive layer from opaque to transparent while maintaining adequate electrical conductivity. The transparent conductive oxide material allows the laser beam to penetrate through and reach the frit for complete welding, while still providing the necessary electrical conductivity for signal transmission in the OLED device.
Solution Approach 2:
The conductive layer is formed as a composite structure using transparent conductive oxide materials that combine electrical conductivity with optical transparency. This composite material approach resolves the contradiction by achieving both electrical functionality and laser beam transmission capability simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability of the organic electro-luminescent device package by ensuring complete laser welding and improved sealing against water and oxygen, thereby extending the device's lifespan and performance.
Implementation Method 1
a laser frit is irradiated by a laser beam, such that the frit is welded to an upper substrate and a lower substrate, respectively
Implementation Method 2
the portion of the conductive layer corresponding to the frit is transparent
Implementation Method 3
water and oxygen can be well blocked by means of the laser frit
Data Source
AI summary
An organic electro-luminescent device package includes an organic electro-luminescent device array substrate, a transparent cover, and a frit. The organic electro-luminescent device array substrate includes a first substrate and a plurality of organic electro-luminescent devices arranged on the first substrate in an array. The transparent cover is disposed over the organic electro-luminescent device array substrate. The transparent cover includes a second substrate and a conductive layer disposed on the second substrate. The organic electro-luminescent devices are located between the first substrate and the second substrate. The frit is disposed between the organic electro-luminescent device array substrate and the transparent cover to surround the organic electro-luminescent devices. The frit is located between the first substrate and a portion of the conductive layer, and the portion of the conductive layer corresponding to the frit is transparent.