OLED Packaging Frit Edge Smoothing via Presintering and Polishing
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Solution Overview
Problem
Traditional packaging methods for OLED devices using frit as a sealant often result in cracks, leading to device failure due to stress points formed by sharp edges on the cured frit.
Innovation Solution
A packaging method involving the formation of a defining pattern with a groove on a base substrate, followed by presintering and polishing of colloidal frit to create a smooth, solid frit surface, which is then assembled with the OLED device, ensuring no potential stress points and enhancing bonding strength through secondary sintering and laser melting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If frit is cured directly after screen printing, then the packaging process is simple, but the cured frit forms sharp edges that create stress points and cause cracks in the OLED device
Solution Approach 1:
The patent applies preliminary action by performing a first sintering process to partially cure the frit before final curing. This intermediate step rounds the sharp edges of the frit while maintaining the overall sealing structure, preventing stress concentration that would lead to cracks in the OLED device during subsequent handling and operation
Solution Approach 2:
The patent changes the thermal processing parameters by implementing two distinct sintering processes with different temperature and time conditions. The first sintering uses controlled parameters to partially cure the frit and round edges, while the second sintering completes the curing process, optimizing both mechanical properties and seal integrity
2Productivity
If the frit surface is left as-cured, then the manufacturing steps are reduced, but the sharp edges on the frit surface create potential stress points
Solution Approach 1:
The first sintering process serves as a preliminary action that partially cures the frit and simultaneously rounds the sharp edges. This intermediate treatment creates a smoother surface profile before the final curing step, eliminating stress concentration points without requiring additional mechanical polishing steps
Solution Approach 2:
The patent utilizes phase transitions of the frit material during controlled thermal sintering processes. The gradual heating and cooling cycles through specific temperature ranges enable the frit to transition from a rigid printed state to a partially cured state with rounded edges, then to a fully cured state, achieving surface smoothing through material phase changes rather than mechanical intervention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents cracks in OLED devices by smoothing the frit surface and increasing bonding strength, thereby extending the device's lifespan and improving packaging efficiency.
Implementation Method 1
presintering the colloidal frit to obtain preliminarily cured frit
Implementation Method 2
polishing upper surfaces of the defining pattern and the preliminarily cured frit
Implementation Method 3
melting the solid frit, so that the packaging substrate and the substrate having the electronic device formed thereon are bonded together
Implementation Method 4
the solid frit is irradiated with laser to melt the solid frit
Data Source
AI summary
The present invention provides a packaging method for an electronic device, which includes a step of forming a packaging substrate, the step of the forming a packaging substrate includes: forming, on a base substrate, a defining pattern which comprises a groove for defining position of frit; providing colloidal frit in the groove; presintering the colloidal frit to obtain preliminarily cured frit; polishing upper surfaces of the defining pattern and the preliminarily cured frit; and removing the defining pattern, and completely curing the preliminarily cured frit, so as to form solid frit on the base substrate. The present invention also provides a packaging system. By using the packaging method provided by the present invention, a better packaging effect can be achieved.