OLED Frit Seal Segmentation for Thermal Damage Prevention
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Solution Overview
Problem
The existing organic light emitting display (OLED) packaging methods face challenges in preventing damage from excessive heat generated when a laser irradiates the glass frit used for sealing, which can lead to decreased adhesive strength and potential thermal damage to conductive lines and organic layers.
Innovation Solution
The solution involves arranging the glass frit segments to surround the OLED array with conductive lines positioned laterally apart from the frit, ensuring no conductive lines are parallel to the frit segments, thereby minimizing heat transfer and preventing damage during laser irradiation for sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass frit is used for sealing the substrate with laser irradiation, then sealing reliability is improved, but thermal damage to conductive lines and organic layers occurs
Solution Approach 1:
The glass frit seal is divided into multiple segments arranged in a specific pattern. By segmenting the frit structure, the patent creates gaps between segments that prevent continuous heat transfer to conductive lines, while still maintaining effective sealing functionality across the substrate edge.
Solution Approach 2:
The patent applies different spatial arrangements of frit segments relative to conductive lines. In regions where conductive lines are present, frit segments are positioned laterally apart or at angles to minimize thermal exposure. This local optimization allows sealing reliability while protecting thermally sensitive areas.
2Volume of moving object
If conductive lines are positioned close to glass frit for compact design, then device compactness is improved, but adhesive strength decreases due to heat
Solution Approach 1:
The patent employs asymmetric positioning of frit segments relative to conductive lines. Instead of uniform spacing, the arrangement creates asymmetric thermal zones where the hottest regions are deliberately positioned away from conductive lines, while still achieving compact overall device dimensions.
Solution Approach 2:
The patent addresses the two-dimensional conflict between compactness and heat protection by introducing angular/directional considerations. Frit segments are oriented at specific angles relative to conductive lines, creating three-dimensional spatial relationships that protect against heat while maintaining planar compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively inhibits damage to the organic planarization layer and conductive lines from heat generated during laser irradiation, maintaining adhesive strength and enabling more compact OLED designs.
Implementation Method 1
minimizing heat transfer and preventing damage during laser irradiation for sealing
Implementation Method 2
heat generated when the laser irradiates a glass frit for sealing a substrate
Data Source
AI summary
An organic light emitting device according to one embodiment of the present invention comprises a first substrate defining a pixel region and a non-pixel region; an array of organic light emitting pixels formed in the pixel region of the first substrate; a second substrate placed over the first substrate, the array being interposed between the first and second substrates; a frit seal interposed between and interconnecting the first and second substrates, wherein the frit seal comprises a plurality of elongated segments, which in combination surrounds the array; and at least one conductive line formed in the non-pixel region and elongated substantially parallel to one of the plurality of elongated segments of the frit seal, wherein no conductive line in the non-pixel region is elongated substantially parallel to one of the elongated segments and overlaps the elongated segment substantially parallel thereto when viewed from the first or second substrate.