Organic Light-Emitting Display Groove for Void-Free Bonding
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Solution Overview
Problem
In the manufacturing of organic light-emitting display devices, voids often form between the adhesive layer and the anisotropic conductive film during the bonding process of the organic light-emitting array and the touch electrode array, leading to reliability issues with the touch electrode wires due to outgassing and increased thermosetting time.
Innovation Solution
The introduction of a groove in the non-display area of the thin-film transistor array and the touch electrode array, which corresponds to the area where the adhesive layer and seal material contact, functions to trap or discharge out-gas, preventing void formation and ensuring a reliable bond between the organic light-emitting array and the touch electrode array.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the bonding process uses a thermosetting process to cure the adhesive layer and anisotropic conductive film, then the bonding strength between the organic light-emitting array and touch electrode array is improved, but the thermosetting time increases and outgassing occurs leading to void formation
Solution Approach 1:
The bonding process is divided into two distinct stages: a preliminary bonding stage at lower temperature (60-90°C) for 1-5 minutes to establish initial adhesion, and a subsequent curing stage at higher temperature (100-150°C) for 5-30 minutes to achieve full bonding strength. This segmentation allows the adhesive to set gradually, preventing outgassing entrapment and void formation while maintaining bonding strength.
Solution Approach 2:
The preliminary bonding stage performs the initial adhesion function before the final curing stage. By applying heat and pressure first at lower intensity to establish basic bonding, the structure is prepared to withstand the subsequent outgassing during the curing phase, preventing void formation in critical areas.
2Reliability
If the thermosetting time is increased to ensure complete curing of the adhesive layer, then the bonding reliability is improved, but outgassing increases causing void formation between the adhesive layer and anisotropic conductive film
Solution Approach 1:
The curing process uses periodic heating with two distinct temperature phases: a preliminary phase at 60-90°C for 1-5 minutes followed by a final phase at 100-150°C for 5-30 minutes. This periodic temperature application allows controlled outgassing during the transition, preventing gas entrapment while ensuring complete curing for bonding reliability.
Solution Approach 2:
The temperature parameter is changed in two stages: first held at 60-90°C for preliminary bonding, then increased to 100-150°C for final curing. This parameter change strategy manages the outgassing rate to prevent void formation while achieving complete adhesive curing for reliable bonding.
3Stability of the object's composition
If the adhesive layer and anisotropic conductive film are bonded tightly without gaps, then the structural integrity is improved, but outgassing during thermosetting creates voids that deteriorate touch electrode wire reliability
Solution Approach 1:
The bonding process is segmented into preliminary bonding and final curing stages, allowing the adhesive to gradually set and release gases without creating voids. This maintains both structural integrity and touch electrode wire reliability by preventing gas entrapment during the bonding process.
Solution Approach 2:
The preliminary bonding stage establishes initial adhesion before the final curing stage, creating a gradual bonding sequence that allows outgassing to occur without trapping gases between layers. This preserves both structural integrity and prevents deterioration of touch electrode wire reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The groove effectively prevents void formation by discharging out-gas, ensuring a filled boundary between the adhesive layer and the seal material, thereby enhancing the reliability of the organic light-emitting display device by preventing disconnection faults in the routing lines and maintaining the integrity of the touch electrode array.
Implementation Method 1
an adhesive layer that bonds the touch electrode array and the organic light-emitting array so as to face each other
Implementation Method 2
At least one groove is provided in the non-display area of the thin-film transistor array and is located in an area that corresponds to an area in which the seal material and the adhesive layer are in contact with each other
Data Source
AI summary
Disclosed is an organic light-emitting display device capable of removing a void between a pad area and a display area. The display device having a display area and a non-display area includes a thin-film transistor array, an organic light-emitting array, a touch electrode array, and an adhesive layer between the touch electrode array and the organic light-emitting array. A lower pad portion having lower electrodes is provided in the non-display area of the thin-film transistor array, an upper pad portion having upper electrodes is provided in the non-display area of the touch electrode array, and both the pad portions are bonded to each other by a seal material having one side in contact with the adhesive layer. At least one groove is provided in the non-display area of the thin-film transistor array so as to correspond to the contact area of the seal material and the adhesive layer.