OLED Planarization Isolation Groove Filling to Prevent Touch Shorts
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Solution Overview
Problem
The design of waterproof grooves in non-display regions of OLED display panels leads to height section differences, which can cause short circuits of touch leads due to metal residues, compromising the integrity of the display substrate.
Innovation Solution
A display substrate design featuring a first isolation groove in the planarization layer and a graded organic encapsulation layer that fills the groove, maintaining a flat surface and preventing height section differences, thereby avoiding short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If waterproof grooves are designed in OLED display panels to prevent water vapor invasion, then water vapor protection is improved, but height section differences cause metal residues and potential short circuits in touch wiring layers
Solution Approach 1:
The patent introduces an intermediary filling material (organic encapsulation layer or planarization layer) that fills the isolation groove to eliminate height differences. This intermediary substance serves as a mediator between the waterproof groove structure and the touch wiring layer, preventing direct contact and potential short circuits while maintaining the waterproof function.
Solution Approach 2:
The patent addresses the height dimension issue by adding a vertical filling component (isolation groove filling material) that extends from the groove bottom to the surface level. This dimensional approach transforms the two-dimensional groove structure into a three-dimensional filled structure, eliminating the height section difference that causes short circuits.
2Object-affected harmful factors
If isolation grooves are designed to block water vapor, then waterproofing is improved, but height section differences create metal residues affecting touch structure reliability
Solution Approach 1:
The patent applies preliminary action by filling the isolation groove with organic encapsulation layer or planarization layer during the manufacturing process. This preliminary filling action prevents height section differences from forming in the final structure, ensuring surface planarity before subsequent processing steps and avoiding metal residue issues.
Solution Approach 2:
The patent changes the physical parameter of the isolation groove from an empty recessed structure to a filled structure with controlled material composition. By adjusting the filling material parameters (organic encapsulation layer or planarization layer), the structure achieves both waterproofing and surface planarity requirements.
Data Source
AI summary
A display substrate includes a base substrate, and a drive circuit layer, a first planarization layer, and an organic encapsulation layer disposed on the base substrate sequentially. The first planarization layer has a first isolation groove in a peripheral region. The organic encapsulation layer includes a first portion and a second portion located in the peripheral region. The second portion is located on a side of first portion close to a display region. The second portion has a first height, a height of the first portion gradually decreasing from the first height to a second height along a direction away from the display region. The first isolation groove is located on a side of first portion close to the display region. An orthographic projection of at least one of the first portion and second portion on the base substrate covers an orthographic projection of the first isolation groove.