OLED Display Heat Dissipation Plate With Embossed Adhesive
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Solution Overview
Problem
Organic light emitting diode (OLED) display devices generate heat during operation, which can degrade the device and reduce image quality, particularly in larger and higher resolution displays, necessitating effective heat dissipation solutions.
Innovation Solution
The display device incorporates a heat dissipation plate attached to the display panel via an adhesive layer with embossed patterns to facilitate rapid heat discharge, and includes a buffer member with a protrusion to protect sensitive components from contact and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation plate is attached directly to the display panel, then heat dissipation efficiency is improved, but bubbles may form during assembly affecting image quality
Solution Approach 1:
The adhesive layer is designed with an embossed pattern creating a micro-structured surface that allows air bubbles to escape during assembly while maintaining effective thermal contact between the heat dissipation plate and display panel. The embossed pattern provides pathways for bubble release without compromising heat transfer efficiency.
2Illumination intensity
If the display device has larger size and higher resolution, then light output and image quality are improved, but heat generation increases
Solution Approach 1:
The patent converts the harmful heat generated by high-resolution, large-size displays into a manageable thermal flow by attaching a heat dissipation plate with optimized embossed adhesive patterns. The embossed structure facilitates efficient heat extraction pathways, transforming the heat problem into a controlled thermal management solution that enables higher light output without excessive temperature rise.
3Device complexity
If components are placed closer to the display panel, then device complexity is reduced, but heat transfer to sensitive components increases
Solution Approach 1:
The heat dissipation plate features localized embossed patterns with varying densities and depths in different regions. Areas closer to sensitive components have optimized patterns that provide thermal management while maintaining component proximity. This local variation in adhesive structure allows close component placement without excessive heat transfer to sensitive elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents bubble formation during assembly, reduces local heat buildup, and enhances image quality and lifespan by ensuring efficient heat dissipation and protecting critical components.
Implementation Method 1
the adhesive layer has a plurality of embossed patterns at a surface on the display panel side
Implementation Method 2
a heat dissipation plate having a top surface attached to a first surface of the display panel
Implementation Method 3
a buffer member between the driver integrated circuit and the display panel and between the source printed circuit board and the display panel
Data Source
AI summary
Discussed is a display device including a display panel, a heat dissipation plate having a top surface attached to a first surface of the display panel, and an adhesive layer between the display panel and the heat dissipation plate. The adhesive layer has a plurality of embossed patterns at a surface on the display panel side.