OLED Display Heat Dissipation Plate With Embossed Adhesive Interface
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Solution Overview
Problem
Organic light emitting diode (OLED) display devices generate heat during operation, which can degrade the device and cause image quality issues, particularly in larger and higher resolution displays.
Innovation Solution
A display device with a heat dissipation member, including a heat dissipation plate attached to the display panel via an adhesive layer with embossed patterns to minimize bubble formation and a buffer member with a protrusion to protect sensitive components, ensuring efficient heat dissipation and preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation plate is attached to the display panel, then heat dissipation efficiency is improved, but bubble formation in the adhesive layer deteriorates image quality
Solution Approach 1:
The adhesive layer is pre-formed with embossed patterns before attaching the heat dissipation plate. This preliminary structuring of the adhesive layer creates air channels that prevent bubble formation during the attachment process, allowing subsequent heat dissipation without quality degradation
Solution Approach 2:
The adhesive layer is designed with an embossed pattern structure that creates porous channels. These pores allow air to escape during attachment and prevent bubble formation, while maintaining adequate adhesive contact for effective heat dissipation between the display panel and heat dissipation plate
2Productivity
If the display device has larger size and higher resolution, then information display capability is improved, but heat generation increases
Solution Approach 1:
The adhesive layer is segmented into multiple embossed patterns rather than being a continuous uniform layer. This segmentation creates a structured interface that maintains thermal contact while managing heat distribution across the larger display area, addressing the increased heat generation from higher resolution and larger size
Solution Approach 2:
The embossed adhesive layer acts as an intermediary structure between the display panel and heat dissipation plate. It facilitates heat transfer from the high-resolution display elements to the heat dissipation plate while preventing direct adhesive contact that would cause bubbles, thus managing the thermal load from improved display capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effective heat dissipation reduces local heating, prevents afterimages, improves luminance and image quality, and extends the lifespan of the display device.
Implementation Method 1
a heat dissipation plate having a top surface attached to a first surface of the display panel, and an adhesive layer between the display panel and the heat dissipation plate
Implementation Method 2
a buffer member between the driver integrated circuit and the display panel and between the source printed circuit board and the display panel, wherein the buffer member has a protrusion corresponding to the driver integrated circuit
Data Source
AI summary
A display device can include a display panel including a substrate, a thin film transistor on the substrate and including an oxide semiconductor material, an overcoat layer on the thin film transistor, and a light emitting diode on the overcoat layer and including a first electrode, a light-emitting layer, and a second electrode. Also, the display device can further include an encapsulation film on the display panel, a heat dissipation plate on the encapsulation film, and an adhesive layer between the encapsulation film and the heat dissipation plate and having a plurality of embossed patterns.