Inorganic Layer Encapsulation for OLED Moisture Barrier

The encapsulation structure is divided into multiple segments: the first interlayer dielectric layer forms a first encapsulation structure, the planarization layer forms a second encapsulation structure, and the inorganic layer forms a third encapsulation structure. This segmented approach creates multiple barrier layers that collectively prevent moisture and oxygen intrusion from both upper and bottom directions, resolving the contradiction between blocking top intrusion and preventing bottom erosion.

The encapsulation structure combines multiple materials with different properties: the first interlayer dielectric layer (inorganic), the planarization layer (organic), and the inorganic layer (inorganic). This composite structure leverages the complementary properties of different materials to achieve comprehensive moisture and oxygen barrier performance, protecting against intrusion from all directions.

The solution moves from a single-layer approach to a multi-dimensional layered structure. The encapsulation structure extends vertically through multiple layers (first interlayer dielectric layer, planarization layer, inorganic layer), creating a three-dimensional barrier system that maintains moisture and oxygen protection even in the bending area where the organic filling layer is present.

The inorganic layer acts as an intermediary barrier between the organic filling layer (which relieves bending stress but has poor barrier performance) and the light emitting layer (which needs protection). This intermediary layer provides the necessary moisture and oxygen protection while allowing the organic filling layer to perform its stress relief function.