OLED Interconnection Cladding for Sealant Heat Short Circuit Prevention
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Solution Overview
Problem
OLED display devices face short circuits between interconnections due to heat applied to cure the sealant, which can cause expansion or melting of interconnection materials, leading to electrical failures.
Innovation Solution
Incorporating cladding parts made of materials with higher melting points than the interconnections, these cladding parts cover at least a portion of the interconnections at locations corresponding to the sealant, preventing short circuits by maintaining structural integrity even when the sealant is plasticized during thermal treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the sealant is applied to adhere substrates, then substrate bonding is achieved, but interconnections in the sealant portion may short circuit due to heat expansion
Solution Approach 1:
The protective layer acts as a thermal intermediary positioned between the sealant and interconnections. It absorbs and blocks thermal energy during sealant curing, preventing the heat-induced expansion and melting of interconnections while allowing the sealant to perform its bonding function effectively
Solution Approach 2:
The protective layer is applied beforehand to cover the interconnections in the sealant portion before the sealant curing process. This prior protection creates a thermal cushion that prevents harmful heat effects from reaching the interconnections during the subsequent thermal treatment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents short circuits between interconnections, enhancing the safety and reliability of OLED display devices by ensuring that the interconnections remain functional and secure during the curing process of the sealant.
Implementation Method 1
the sealant is plasticized through thermal treatment to adhere the first substrate to the second substrate
Implementation Method 2
each of the cladding parts including a material having a higher melting point than that of the interconnections
Data Source
AI summary
An organic light emitting diode (OLED) display device, including a first substrate and a second substrate facing each other, a sealant arranged between the first and second substrates to adhere the first and second substrates together, a plurality of interconnections arranged on one of the first and second substrates and a plurality of cladding parts covering at least a portion of each of the plurality of interconnections at a location that corresponds to the sealant, each of the cladding parts including a material having a higher melting point than that of the interconnections. By including the cladding parts, a short circuit between the interconnections caused by heat applied to the sealant can be prevented, and safety and reliability of the OLED display device can be improved.


