OLED Interconnection Cladding for Sealant Heat Short Circuit Prevention

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Solution Overview

Problem

OLED display devices face short circuits between interconnections due to heat applied to cure the sealant, which can cause expansion or melting of interconnection materials, leading to electrical failures.

Innovation Solution

Incorporating cladding parts made of materials with higher melting points than the interconnections, these cladding parts cover at least a portion of the interconnections at locations corresponding to the sealant, preventing short circuits by maintaining structural integrity even when the sealant is plasticized during thermal treatment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the sealant is applied to adhere substrates, then substrate bonding is achieved, but interconnections in the sealant portion may short circuit due to heat expansion

Engineering Contradiction:
Improvesubstrate bonding strengthVSAvoidheat-induced short circuit
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The protective layer acts as a thermal intermediary positioned between the sealant and interconnections. It absorbs and blocks thermal energy during sealant curing, preventing the heat-induced expansion and melting of interconnections while allowing the sealant to perform its bonding function effectively

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The protective layer is applied beforehand to cover the interconnections in the sealant portion before the sealant curing process. This prior protection creates a thermal cushion that prevents harmful heat effects from reaching the interconnections during the subsequent thermal treatment

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents short circuits between interconnections, enhancing the safety and reliability of OLED display devices by ensuring that the interconnections remain functional and secure during the curing process of the sealant.

Implementation Method 1

the sealant is plasticized through thermal treatment to adhere the first substrate to the second substrate

Methodology Applied
Scientific EffectThermal treatment: Heating

Implementation Method 2

each of the cladding parts including a material having a higher melting point than that of the interconnections

Methodology Applied
Scientific EffectMelting point difference: Melting

Data Source

PatentUS9437666B2OLED display device that prevents shorting of interconnections during manufacture thereof
Publication Date: 2016.09.06 SAMSUNG DISPLAY CO LTD
  • US9437666B2 patent drawing
  • US9437666B2 patent drawing
  • US9437666B2 patent drawing

AI summary

An organic light emitting diode (OLED) display device, including a first substrate and a second substrate facing each other, a sealant arranged between the first and second substrates to adhere the first and second substrates together, a plurality of interconnections arranged on one of the first and second substrates and a plurality of cladding parts covering at least a portion of each of the plurality of interconnections at a location that corresponds to the sealant, each of the cladding parts including a material having a higher melting point than that of the interconnections. By including the cladding parts, a short circuit between the interconnections caused by heat applied to the sealant can be prevented, and safety and reliability of the OLED display device can be improved.