OLED Bezel Reduction via Inverted Welding and Substrate Concavity
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Solution Overview
Problem
Existing organic electroluminescent devices have a wide bezel due to the need for bending a flexible printed circuit board, which limits their narrow bezel design and flexibility.
Innovation Solution
The organic electroluminescent device incorporates a concave part on the base substrate to expose the welding part of the peripheral wiring structure, allowing the flexible printed circuit board to be welded directly without bending, reducing the bezel width by eliminating the need for a bending space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the welding terminal of the flexible printed circuit board is welded on a side of the welding part away from the base substrate, then the electrical connection between the flexible printed circuit board and the peripheral wiring is realized, but the flexible printed circuit board needs to be bent to the side of the base substrate, requiring a bending width to be reserved, resulting in a wide bezel
Solution Approach 1:
The patent inverts the conventional welding arrangement by positioning the welding terminal on the side of the welding part closer to the base substrate rather than away from it. This inversion eliminates the need for bending the flexible printed circuit board, as the welding can be performed directly on the exposed welding part, thereby removing the requirement for bending width reservation and reducing the bezel width.
Solution Approach 2:
The patent changes the spatial dimension of the welding operation by exposing the welding part through a concave structure on the base substrate. This dimensional change allows the welding terminal to access the welding part from the front side rather than requiring backside access, eliminating the need for board bending and reducing the bezel width while maintaining welding accessibility.
2Reliability
If the flexible printed circuit board is bent to achieve welding connection, then the electrical connection is established, but the bending width for the flexible printed circuit board needs to be reserved on the side corresponding to the flexible printed circuit board
Solution Approach 1:
The patent inverts the welding approach by bringing the welding terminal to the welding part through a concave exposure structure rather than bending the flexible printed circuit board. This inversion maintains reliable electrical connection while eliminating the need for bending width, thereby reducing the bezel area.
3Length of stationary object
If the welding part is exposed through a concave part on the base substrate, then the flexible printed circuit board can be welded directly without bending, but the base substrate structure becomes more complex
Solution Approach 1:
The patent segments the base substrate structure by creating a localized concave part that exposes only the welding part, rather than redesigning the entire base substrate. This segmentation approach reduces the overall structural complexity while achieving the goal of direct welding and reduced bezel width.
Solution Approach 2:
The patent applies local quality by creating a concave structure only at the specific location where the welding part needs to be exposed. This localized modification minimizes the impact on the overall base substrate structure, maintaining simplicity elsewhere while achieving the welding accessibility needed to reduce bezel width.
Data Source
Figure 1~3
Figure 4a~4c
Figure 5a~5c
AI summary
An organic electroluminescent device and a manufacturing method thereof, and a display device. The organic electroluminescent device comprises comprising a base substrate (1), a packaging structure (7), an organic electroluminescent structure (5) located between the base substrate (1) and the packaging structure (7), and a flexible printed circuit board (4); the base substrate (1) being provided with a peripheral wiring structure (3) electrically connected with an internal wiring of the organic electroluminescent structure (5); the peripheral wiring structure (3) including a welding part (32). The welding part (32) has a first surface facing the base substrate (1), at least a portion of the first surface being exposed to electrically connect with a welding terminal of the flexible printed circuit board (4).