OLED Package Lid Recess with Corrugation Projections
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Solution Overview
Problem
Conventional OLED package structures have a large gap that reduces mechanical strength and makes them prone to breaking, while also failing to provide adequate sealing to protect the sensitive organic material from moisture and oxygen.
Innovation Solution
The package structure incorporates a recess in the package lid with corrugation projection structures and calcium oxide desiccant attached to the bottom of the recess, which enhances mechanical strength and sealing tightness by absorbing moisture and improving resistance to shocks and pressurization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dam-and-desiccant packaging structure is used for OLED devices, then moisture absorption capability is improved, but mechanical strength is reduced and the structure becomes prone to breaking
Solution Approach 1:
The packaging structure is divided into multiple functional regions: a sealing region with enclosure resin for moisture protection, and a reinforcement region with protrusions on the package lid that engage with recesses in the substrate to provide mechanical strength. This segmentation allows each region to optimize its specific function without compromising the other.
Solution Approach 2:
The invention merges the sealing function and structural reinforcement function into a single integrated package structure. The enclosure resin simultaneously provides sealing and structural support, while the protrusions and recesses create interlocking joints that reinforce the overall structure while maintaining the sealing integrity.
2Reliability
If a large gap is left in the package structure for desiccant placement, then moisture absorption capacity is improved, but structural integrity deteriorates
Solution Approach 1:
The package lid is designed with localized protrusions in specific regions where structural reinforcement is needed, while maintaining large open spaces in other regions for desiccant placement. This local quality approach provides structural integrity only where necessary while preserving moisture absorption capacity where required.
Solution Approach 2:
The package structure combines the package lid with protrusions, the substrate with recesses, and enclosure resin to create a composite structure. This composite design allows the structure to simultaneously achieve mechanical strength through the interlocking geometry and moisture absorption through the desiccant spaces.
3Length of moving object
If the package lid is made thinner to reduce device thickness, then flexibility and thinness are improved, but resistance to shocks and pressurization deteriorates
Solution Approach 1:
Instead of increasing the thickness of the package lid in the vertical dimension, the invention adds structural reinforcement in the horizontal dimension through protrusions and recesses. This dimensional shift allows the lid to remain thin while gaining mechanical strength through the interlocking geometry that distributes shock and pressurization forces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases the mechanical strength and sealing efficiency of the OLED package, extending its lifespan and simplifying the manufacturing process while maintaining high operability.
Implementation Method 1
desiccant that is arranged between the substrate 100 and the package lid 200 and mounted to the package lid 200... The desiccant 210 is mounted in the recess 220 to absorb moisture penetrating through the enclosure resin 300
Data Source
AI summary
An OLED package structure includes a substrate, a package lid arranged opposite to the substrate, an OLED device arranged between the substrate and the package lid and mounted to the substrate, and enclosure resin located between the substrate and the package lid and bonding the substrate and the package lid together. The package lid includes a recess formed therein at a location corresponding to the OLED device. The recess includes therein a plurality of corrugation projection structures arranged therein and extending outwards from a bottom of the recess. Desiccant is attached to the bottom of the recess in an area between two adjacent ones of the corrugation projection structures.