OLED Signal Connection Line Sealing With Doped Semiconductor Layout
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Solution Overview
Problem
The poor sealing of the lowermost layer of the encapsulation layer to the signal connection line in OLED display panels allows water and oxygen to enter the display region, causing failure and abnormal displaying.
Innovation Solution
A display panel design featuring a substrate with a silicon-containing compound material, a display unit, a binding unit with signal connection lines, and a laminated encapsulation layer comprising silicone-containing and organic materials, where at least a portion of the signal connection lines are heavily doped semiconductor lines to enhance sealing effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the encapsulation layer covers the entire OLED display panel to block external water and oxygen, then the protection against water and oxygen is improved, but the sealing to the signal connection line becomes poor, allowing water and oxygen to enter along the connection line
Solution Approach 1:
The patent applies different material properties to different regions of the signal connection line. The first region (exposed portion) uses a material with good planarization properties to ensure flat surface for binding unit connection, while the second region (covered portion) uses a material with low water and oxygen permeability to ensure sealing. This local differentiation resolves the contradiction between overall protection and local sealing precision.
Solution Approach 2:
The signal connection line is constructed using composite materials with different functional characteristics. The first material layer provides planarization and structural support, while the second material layer provides barrier properties against water and oxygen penetration. This composite structure enables the connection line to simultaneously achieve good sealing and proper electrical connection functionality.
2Manufacturing precision
If the lowermost layer of the encapsulation layer is sealed to the signal connection line, then the sealing is improved, but the binding portion cannot be properly connected to the driver IC
Solution Approach 1:
The signal connection line is segmented into two distinct regions: an exposed portion and a covered portion. The exposed portion remains uncovered by the encapsulation layer, providing access for the binding unit to connect to the driver IC. The covered portion is sealed by the encapsulation layer to prevent water and oxygen ingress. This segmentation allows both sealing and connectivity requirements to be satisfied simultaneously.
Solution Approach 2:
The signal connection line acts as an intermediary structure between the encapsulation layer and the driver IC. By having portions exposed and portions covered, it mediates between the conflicting requirements of sealing (requiring complete coverage) and connectivity (requiring exposed areas). The binding unit connects to the exposed portion while the encapsulation layer seals the covered portion, resolving the contradiction.
Data Source
AI summary
A display device includes a substrate, a display unit, a binding unit, and an encapsulation layer. The substrate includes an effective display region and a non-display region adjacent to the effective display region, and includes a silicon-containing compound material. The display unit is arranged in the effective display region. The binding unit is arranged in the non-display region and includes a binding portion and signal connection lines. Two ends of the signal connection line are connected to the display unit and the binding portion, respectively. The encapsulation layer wraps the display unit and a part of the signal connection lines The encapsulation layer covers a portion of each of the plurality of signal connection lines, at least a portion of each of the plurality of signal connection lines disposed inside a region covered by the encapsulation layer is configured as a heavily doped semiconductor connection line.