OLED Substrate Laminating Lower Film with Dual Adhesion Layers
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Solution Overview
Problem
In the manufacturing of organic light emitting diode (OLED) displays, the thermal lamination of a doner film to a lower film under a substrate often results in inadequate adhesion, leading to film rupture and non-uniformity during the peeling process, which can cause the mura phenomenon.
Innovation Solution
A substrate laminating lower film with a base member, a first adhesion layer having strong adhesion, and a second adhesion layer with weaker adhesion is used, allowing for stable lamination and peeling by controlling the adhesion between the doner film and the substrate, preventing film rupture and non-uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the adhesion between the lower film and doner film is increased to maintain stable lamination, then the adhesion strength is improved, but film rupture and non-uniformity occur during the peeling process
Solution Approach 1:
The lower film is divided into two distinct adhesion layers: a first adhesion layer with strong adhesion force for stable lamination during deposition, and a second adhesion layer with weak adhesion force for uniform peeling. This segmentation allows each layer to perform its specific function without compromising the other, resolving the contradiction between strong adhesion and easy peeling.
Solution Approach 2:
Different regions of the lower film structure are assigned different adhesion properties. The first adhesion layer has high adhesion strength localized at the interface with the doner film for stable bonding, while the second adhesion layer has low adhesion strength localized at the interface with the substrate for controlled peeling. This local differentiation of properties enables simultaneous achievement of strong bonding and easy separation.
2Strength
If thermal lamination is performed to firmly maintain substrate-doner film lamination, then the adhesion is improved, but the doner film may not be properly laminated if it is cured or not made of thermally meltable material
Solution Approach 1:
The first adhesion layer acts as an intermediary between the doner film and the second adhesion layer. It provides the thermal lamination function with high adhesion strength for materials that require thermal bonding, while the second adhesion layer provides a low-adhesion interface for materials that should not be thermally bonded. This intermediary structure enables the system to handle both thermally meltable and non-thermally meltable doner films.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures appropriate adhesion with the doner film, stabilizes the lamination process, and prevents the mura phenomenon during the peeling process, facilitating the stable transfer of the light emitting layer in OLED displays.
Implementation Method 1
a first adhesion layer which is formed on the base member and has first adhesion
Implementation Method 2
a second adhesion layer which is formed on the first adhesion layer and has second adhesion smaller than the first adhesion
Implementation Method 3
heating contact portions between the second adhesion layer and the doner film to attach the second adhesion layer and the doner film to each other
Data Source
AI summary
A substrate laminating low film, a substrate laminated structure and a method of manufacturing an organic light emitting display are disclosed. One inventive aspect includes a base member, a first adhesion layer formed on the base member, and a second adhesion layer formed on the first adhesion layer. The second adhesion layer has a second adhesion strength less than the first adhesion strength of the first adhesion layer.