OLED Deposition Mask Crystal Plane Control
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Solution Overview
Problem
Existing deposition masks for OLED pixel deposition suffer from non-uniform through-hole sizes, leading to reduced uniformity and efficiency in organic material deposition, as the size of the through-holes is not uniform, affecting the formation of pixel patterns on substrates.
Innovation Solution
A deposition mask with a metal plate composed of iron and nickel, where the metal plate's first and second surfaces have specific crystal plane ratios controlled through heat treatment and rolling processes, ensuring uniformity in hole diameters by optimizing the diffraction intensity ratios of (111), (200), and (220) crystal planes, thereby improving the uniformity and efficiency of organic material deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional deposition mask is used, then the deposition process can be performed, but the through-hole sizes are non-uniform leading to reduced deposition uniformity
Solution Approach 1:
The patent applies parameter changes by controlling the crystal plane ratios (specifically the (200) and (220) planes) of the metal plate material through heat treatment processes. By adjusting the diffraction intensity ratios of different crystal planes, the etching behavior is modified to achieve uniform through-hole sizes, directly resolving the contradiction between manufacturing precision and deposition reliability
Solution Approach 2:
The patent uses a composite material approach by selecting a specific metal plate composition containing iron (Fe) and nickel (Ni) with controlled crystal structures. This composite material design, combined with heat treatment, creates a material with optimized etching characteristics that produce uniform through-holes, thereby improving both manufacturing precision and deposition uniformity
2Strength
If the metal plate thickness is increased, then the mask durability improves, but the through-hole uniformity deteriorates
Solution Approach 1:
The patent resolves this contradiction by changing the crystal plane ratio parameters of the metal plate. By optimizing the ratio of (200) to (220) crystal planes through controlled heat treatment, the etching process produces uniform through-holes even in thicker metal plates (15-30 μm), thereby maintaining both mask durability and through-hole uniformity
Solution Approach 2:
The patent applies preliminary action by performing heat treatment on the metal plate before through-hole formation to pre-establish the optimal crystal plane ratios. This preliminary crystal structure optimization ensures that subsequent etching processes produce uniform through-holes regardless of the metal plate thickness, allowing the mask to maintain both strength and precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The controlled crystal plane ratios on the metal plate's surfaces enhance the uniformity of hole diameters, leading to improved thickness uniformity and deposition efficiency of organic materials on the substrate, resulting in more consistent pixel patterns.
Implementation Method 1
when diffraction intensity with respect to a (111) crystal plane of the first surface layer is defined as I (111), diffraction intensity with respect to a (200) crystal plane is defined as I (200), and diffraction intensity with respect to a (220) crystal plane is defined as I (220)
Implementation Method 2
the metal plate's first and second surfaces have specific crystal plane ratios controlled through heat treatment and rolling processes
Data Source
AI summary
A deposition mask according to an embodiment includes a metal plate including a first surface and a second surface opposite to the first surface wherein the metal plate includes iron (Fe) and nickel (Ni), a thickness of the metal plate is 15 μm to 30 μm, and the metal plate includes a first surface layer having a depth of 20% or less of the thickness of the metal plate from the first surface and a second surface layer having a depth of 20% or less of the thickness of the metal plate from the second surface, wherein when diffraction intensity with respect to a (111) crystal plane of the first surface layer is defined as I (111), diffraction intensity with respect to a (200) crystal plane is defined as I (200), and diffraction intensity with respect to a (220) crystal plane is defined as I (220), a ratio of diffraction intensity of I (220) is defined by Equation 1 below,A=I(220)/(I(200)+I(220)+I(111)) [Equation]a ratio of diffraction intensity of I (200) is defined by Equation 2 below,B=I(200)/(I(200)+I(220)+I(111)) [Equation 2]a ratio of diffraction intensity of I (111) is defined by Equation 3 below,C=I(111)/(I(200)+I(220)+I(111)) [Equation 3]a value of the A is greater than a value of the B and a value of the C, the value of the B is greater than the value of the C, and when a ratio of the B to the A (B/A) is defined as D, a value of the D is 0.5 to less than 1.