OLED Display Metal Encapsulant Thermal Deformation Control
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Solution Overview
Problem
Organic light emitting diode displays face deformation issues due to heat during the curing process of the sealant, which affects the encapsulant and substrate, leading to structural integrity concerns.
Innovation Solution
The implementation of a metal layer with a lower thermal expansion coefficient than the substrate, combined with a resin layer that reinforces the metal layer's strength, and an adhesive layer using thermosetting resin, which minimizes deformation by balancing thermal expansion coefficients and elastic coefficients through specific thickness and material combinations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thermosetting resin sealant is used to bond the substrate and encapsulant, then strong bonding strength is achieved, but heat-induced deformation occurs during the curing process
Solution Approach 1:
The patent changes the thermal parameters of the encapsulant material by using an opaque metal layer with a thermal expansion coefficient specifically selected to be lower than that of the substrate. This parameter change allows the system to withstand the heat of the thermosetting resin curing process without excessive deformation, as the metal encapsulant expands less than the substrate during heating, compensating for the thermal stress generated during sealant curing.
Solution Approach 2:
The patent employs a composite structure where an opaque metal layer serves as the encapsulant and is bonded to the substrate using a thermosetting resin sealant. This composite material system combines the low thermal expansion property of metal with the strong bonding capability of thermosetting resin, achieving both strong bonding and reduced heat-induced deformation simultaneously.
2Manufacturing precision
If an opaque metal layer is used as an encapsulant, then thermal expansion mismatch with the substrate is reduced, but the structural strength and rigidity need reinforcement
Solution Approach 1:
The patent creates a composite encapsulant structure by combining an opaque metal layer with a transparent encapsulant layer. The metal layer provides low thermal expansion to match the substrate and prevent deformation, while the transparent encapsulant layer contributes to the overall structural strength and rigidity of the encapsulation system, thereby reinforcing the metal layer's mechanical properties.
Solution Approach 2:
The encapsulation system is segmented into multiple functional layers: an opaque metal layer specifically designed for thermal expansion matching with the substrate, and a transparent encapsulant layer that provides additional structural support and protection. This segmentation allows each layer to specialize in its primary function while contributing to the overall system performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces thermal deformation and stress in the organic light emitting diode display during the heat-bonding process, enhancing structural integrity and reliability while maintaining low manufacturing costs.
Implementation Method 1
The metal layer can have a lower thermal expansion coefficient than a thermal expansion coefficient of the substrate
Implementation Method 2
The resin layer can be attached to the metal layer
Implementation Method 3
The adhesive layer can include a thermosetting resin
Data Source
AI summary
An organic light emitting diode display is disclosed. The organic light emitting diode display includes: a substrate, an organic light emitting diode positioned on the substrate, a metal layer positioned on the substrate with the organic light emitting diode interposed therebetween, and a resin layer positioned on the metal layer and configured to reinforce a strength of the metal layer.