OLED Metal Layer Heat Dissipation Encapsulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Organic light-emitting diodes (OLEDs) experience uneven ageing and non-homogeneous luminance due to thermal conductivity issues with glass substrates and voltage drops in thin conductor tracks, leading to inefficient heat dissipation and luminance inconsistencies.
Innovation Solution
An optoelectronic device with a functional layer stack encapsulated by a gas-impermeable layer and a metal layer on the encapsulation layer for efficient heat dissipation, where the metal layer covers a significant portion of the encapsulation layer to dissipate heat and reduce voltage drops, and a transparent carrier body with electrodes for radiation transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass substrates are used for OLED encapsulation, then protection from environmental influences is achieved, but thermal conductivity is poor leading to inefficient heat dissipation
Solution Approach 1:
The patent employs a composite encapsulation structure combining glass substrate with metal layers (aluminum or silver) having high thermal conductivity. The metal layers are integrated into the glass substrate to create a composite material system that maintains the protective function of glass while adding efficient heat dissipation capability through the metal's thermal conductivity.
2Device complexity
If thin conductor tracks are used in OLEDs, then manufacturing complexity is reduced, but voltage drops increase leading to non-homogeneous luminance
Solution Approach 1:
The patent introduces local quality enhancement by adding metal layers (aluminum or silver) with high electrical and thermal conductivity at specific locations within the device structure. These metal layers are positioned to provide localized conductivity enhancement in regions where current density is high, thereby reducing voltage drops and improving luminance uniformity without requiring complete redesign of the conductor track system.
3Illumination intensity
If high power is applied to OLEDs for illumination purposes, then luminance output is improved, but uneven ageing occurs due to thermal accumulation
Solution Approach 1:
The patent converts the harmful thermal accumulation effect into a beneficial outcome by integrating metal layers with high thermal conductivity into the device structure. These metal layers, initially introduced to improve electrical conductivity, simultaneously serve as heat sinks that actively conduct heat away from the organic light-emitting layers, thereby preventing thermal accumulation and uneven ageing while maintaining high luminance output.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves homogeneous luminance and efficient heat dissipation, reducing voltage drops and extending the device's service life by using a metal layer for both thermal management and power supply, eliminating the need for a thermally conductive substrate like glass.
Implementation Method 1
the heat generated when the device is in operation can be dissipated via the encapsulation layer directly into the metal layer and out of the element into the surrounding environment
Implementation Method 2
at least one organic active layer, which emits electromagnetic radiation when the device is in operation
Data Source
AI summary
An optoelectronic device is provided which comprises a functional layer stack (6), an encapsulation layer (7) provided for encapsulating the layer stack, and at least one metal layer (8), wherein the functional layer stack comprises at least one organic active layer (63), which emits electromagnetic radiation when the device is in operation, the encapsulation layer completely covers the at least one organic active layer when viewed in plan view onto the layer stack, and the metal layer is arranged on a side of the encapsulation layer remote from the layer stack.