Encapsulation Metal Loop for Narrow Frame OLED Touch
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Solution Overview
Problem
Existing pressure-sensitive touch technologies in display devices require a wide frame for pressure-sensitive wiring, which obstructs the integration of a narrow frame design in portable electronic devices.
Innovation Solution
The organic light-emitting display panel incorporates an encapsulation metal loop that functions as both a laser reflector to melt sealant and as pressure-sensitive wiring, eliminating the need for additional wiring and thus reducing the frame area, allowing for a narrow frame design while maintaining pressure-sensitive touch functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate pressure-sensitive wirings are provided for pressure-sensitive detection units, then pressure-sensitive touch functionality is achieved, but frame area increases causing wide frame design
Solution Approach 1:
The encapsulation metal loop is merged with the pressure-sensitive wirings, where the metal loop serves dual functions: encapsulating the display panel and acting as pressure-sensitive detection wiring. This integration eliminates the need for separate pressure-sensitive wirings, reducing frame area while maintaining touch functionality.
Solution Approach 2:
The encapsulation metal loop is designed to perform multiple functions simultaneously: structural encapsulation, laser reflection for sealant melting, and pressure-sensitive signal detection. This multi-functionality reduces the number of separate components needed, enabling narrow frame design.
2Device complexity
If encapsulation metal loop is etched to form first metal wirings, then pressure-sensitive wirings are integrated, but laser reflection capability may be affected
Solution Approach 1:
The encapsulation metal loop is etched with localized patterns rather than complete removal, creating first metal wirings in specific regions while preserving reflective surfaces in other areas. This localized modification allows wiring integration while maintaining laser reflection capability where needed.
Solution Approach 2:
The encapsulation metal loop is segmented into different functional regions through etching: some segments form conductive wirings for pressure detection, while other segments maintain continuous reflective surfaces for laser sealing. This segmentation allows simultaneous achievement of wiring integration and laser reflection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a narrow frame design in electronic devices while ensuring effective pressure-sensitive touch capabilities without compromising the adhesion between the array substrate and encapsulation glass, thus enhancing user interaction and device aesthetics.
Implementation Method 1
the plurality of first metal wirings can not only function to reflect laser to melt the sealant fully by the reflected laser
Implementation Method 2
reflect laser to melt the sealant fully by the reflected laser
Implementation Method 3
a plurality of pressure-sensitive detection units and an encapsulation metal loop located in the non-display region
Data Source
AI summary
Disclosed are an organic light-emitting display panel and an electronic device. The organic light-emitting display panel comprises: an array substrate, wherein the array substrate comprises a display region and a non-display region surrounding the display region, and the array substrate further comprises a plurality of pressure-sensitive detection units and an encapsulation metal loop located in the non-display region surrounding the display region, a plurality of first metal wirings are partitioned from the encapsulation metal loop, the plurality of first metal wirings are electrically connected with the plurality of pressure-sensitive detection units and are reused as pressure-sensitive wirings of the plurality of pressure-sensitive detection units; and a sealant, wherein the sealant is located on one side of the array substrate that faces away from the encapsulation metal loop, and a projection of the sealant on the encapsulation metal loop overlaps with the encapsulation metal loop.