OLED Encapsulation with Metal Pattern Layer for Moisture Barrier
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Solution Overview
Problem
Existing organic light emitting diodes (OLEDs) face challenges in encapsulation, particularly in preventing moisture and oxygen penetration, which can lead to deformation and reduced lifespan, and require complex processes for electrical connections to external power supplies.
Innovation Solution
An OLED structure featuring a sealing layer, an insulating layer, and a metal pattern layer between the sealing and insulating layers, which includes metal patterns for electrical connections and serves as a barrier against moisture and air, allowing for simplified encapsulation and equipotential electrode connections without the need for carriers or complex cutting processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermosetting or photo-curable adhesive member is used to encapsulate the substrate, then the encapsulation characteristic is improved, but the device complexity and manufacturing process complexity increase
Solution Approach 1:
The encapsulation structure is divided into multiple functional layers: a sealing layer (first encapsulation layer) that provides hermetic sealing, an insulating layer (second encapsulation layer) that provides electrical insulation, and a metal pattern layer that provides electrical connections. This segmentation allows each layer to perform its specific function independently, improving overall encapsulation effectiveness while maintaining manufacturing simplicity through standardized layer formation processes.
2Reliability
If a metal foil is used to form the encapsulation package, then the electrical connection is improved, but the moisture and air barrier performance deteriorates
Solution Approach 1:
The encapsulation structure employs a composite multi-layer configuration combining the sealing layer (providing hermetic barrier against moisture and air), the insulating layer (providing electrical insulation), and the metal pattern layer (providing electrical connectivity). This composite structure allows each material to contribute its superior properties, achieving both effective environmental protection and reliable electrical connections simultaneously.
3Adaptability or versatility
If the organic light emitting diode is covered by a TFT to become an active type, then the device functionality is improved, but the aperture ratio decreases
Solution Approach 1:
The encapsulation layers are formed to extend beyond the peripheral edges of the substrate, creating an overhang structure that provides enhanced sealing and protection without occupying additional planar area within the display region. This dimensional extension into the vertical space above and below the substrate allows the encapsulation to perform its protective function while maintaining the aperture ratio and active display area.
Data Source
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AI summary
Provided are an organic light emitting diode and a method for preparing the same. In more detail, the organic light emitting diode includes a substrate; organic light emitting unit in which a first electrode, an organic material layer, and a second electrode are sequentially laminated on the substrate; and an encapsulation unit encapsulating an outside of the organic light emitting unit, in which the encapsulation unit includes a sealing layer contacting the outside of the organic light emitting unit, an insulating layer provided on the sealing layer, and a metal pattern layer provided between the sealing layer and the insulating layer.