OLED Metal Sheet Thermal Expansion Buffer
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Solution Overview
Problem
The manufacturing of thin flat panel display apparatus and OLED devices is hindered by high material costs and complex processes, particularly due to the use of glass substrates which are prone to external stress and require high-temperature bonding with inorganic sealants like frit, leading to potential damage and reduced mechanical strength.
Innovation Solution
A thin flat panel display apparatus and OLED apparatus are designed using a metal sheet with a lower thermal expansion coefficient polymer layer and an absorbent, sealed with a lower-temperature epoxy-based or silicon-based adhesive, which reduces material costs and simplifies the manufacturing process while preventing damage from external stress and moisture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass substrates with inorganic sealants are used, then sealing reliability is improved, but manufacturing complexity and cost increase due to high-temperature bonding processes
Solution Approach 1:
The patent changes the bonding temperature parameter from high-temperature (inorganic sealant) to low-temperature (organic sealant) processing, thereby simplifying the manufacturing process while maintaining sealing reliability through the specific formulation of the organic sealant composition
Solution Approach 2:
The patent replaces expensive glass substrates with flexible substrates that can be processed more economically, using cost-effective organic sealants instead of expensive inorganic sealants, thereby reducing material costs while achieving the required sealing performance
2Strength
If glass substrates are used, then mechanical strength is improved, but device thickness increases and flexibility is reduced
Solution Approach 1:
The patent replaces rigid glass substrates with flexible substrate films, enabling the display device to achieve reduced thickness and improved flexibility while maintaining adequate mechanical strength through the flexible substrate structure and support mechanisms
Solution Approach 2:
The patent employs composite material structures combining flexible substrates with metal backlights and sealant layers, creating a composite assembly that provides both flexibility and the necessary mechanical strength without requiring thick glass components
3Strength
If high-temperature bonding processes are used, then sealant bonding strength is improved, but substrate damage risk increases
Solution Approach 1:
The patent changes the bonding temperature parameter from high-temperature to low-temperature processing by using organic sealants, thereby maintaining adequate bonding strength while eliminating the risk of substrate damage from thermal stress
Solution Approach 2:
The patent introduces organic sealants as intermediary bonding materials that provide sufficient adhesion at low temperatures, acting as a mediator between the flexible substrate and metal backlight without requiring high-temperature processing that could damage the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in thinner, cost-effective flat panel displays and OLEDs with enhanced mechanical strength and reduced manufacturing time, as the polymer layer acts as a thermal buffer and the adhesive seals the entire space between the substrate and metal sheet, preventing wrinkling and moisture-induced deterioration.
Implementation Method 1
a polymer layer which is disposed on a first surface of the metal sheet and has a lower thermal expansion coefficient compared to that of the metal sheet
Implementation Method 2
an absorbent formed between the substrate and the metal sheet
Data Source
AI summary
A flat panel display apparatus includes a substrate; a display unit which is formed on the substrate and displays an image; a metal sheet which faces towards the substrate; a sealant which fills the entire free space between the substrate and the metal sheet and seals the space between the substrate and the metal sheet; and a polymer layer which is disposed on a surface of the metal sheet and has a lower thermal expansion coefficient than the metal sheet. An organic light-emitting display (OLED) apparatus including a sealant which fills an entire space between a substrate and a metal sheet is also disclosed.