OLED Metal Wire Joining Enhancement Holes Sealant Stripping
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Solution Overview
Problem
OLED displays face mechanical weakness due to a weak adherence interface between the sealant and metal wire, leading to potential stripping or separation of the display substrate and sealing member.
Innovation Solution
Incorporating a metal wire with joining enhancement holes, where the insulating layer and sealant contact through these holes, both made of ceramic-based materials, to enhance bonding strength, with the sealant and sealing member also being ceramic-based, thereby improving mechanical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If sealant and metal wire are made of different materials, then material compatibility is achieved, but adherence interface strength deteriorates
Solution Approach 1:
The insulating layer acts as an intermediary between the metal wire and sealant, providing a bonding interface that improves adhesion. The insulating layer is made of ceramic-based material that can bond to both the metal wire and the sealant, resolving the material incompatibility issue while maintaining strength.
Solution Approach 2:
The metal wire structure is modified by forming holes through it, creating a composite structure where the metal wire and insulating layer work together. This composite approach allows the sealant to bond to both the metal wire and insulating layer, improving overall interface strength.
2Reliability
If sealant is coated along edges of substrate, then sealing function is achieved, but stripping occurs at contact points with metal wire
Solution Approach 1:
The metal wire is segmented by forming multiple holes through it, which divides the contact interface into multiple smaller bonding areas. This segmentation allows the sealant to bond to both the insulating layer and metal wire at multiple points, distributing the stress and preventing stripping.
Solution Approach 2:
The metal wire is transformed into a porous structure by forming holes through it. This porous structure increases the surface area for bonding and allows the sealant to penetrate and bond to both the metal wire and insulating layer, improving bonding strength at the contact points.
3Strength
If joining enhancement holes are formed in metal wire, then bonding strength is improved, but manufacturing complexity increases
Solution Approach 1:
The parameters of the metal wire (such as hole diameter, spacing, and pattern) can be adjusted to optimize bonding strength while controlling manufacturing complexity. By carefully selecting these parameters, the bonding strength is improved without excessively complicating the manufacturing process.
Data Source
AI summary
The present invention is related to an OLED display, and one aspect of the OLED display includes a substrate member, an insulating layer formed on the substrate member, a metal wire formed on the insulating layer and having a plurality of joining enhancement holes, a sealant formed on the metal wire, and a sealing member attached on the sealant. In some embodiments, the joining enhancement holes efficiently suppress stripping of the sealant from the metal wire, since the sealant can integrally bond with the interlayer insulating layer through the joining enhancement holes. This feature may compensate for any weak bonding adherence between the sealant and metal wire. In some embodiments, the area of the joining enhancement holes may range from about 5% to about 60% of the entire area of the metal wire.