OLED Encapsulation Multi-Frit Structure Against Seal Delamination
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Solution Overview
Problem
Existing methods for encapsulating organic light-emitting display devices using frits face challenges such as incomplete melting of frits due to inconsistent laser power, leading to weakened adhesive force and potential infiltration of oxygen or moisture, especially when dealing with large substrates, which can result in device degradation or failure.
Innovation Solution
The use of a plurality of frits, including a primary and secondary frits, which are selectively heated by a laser at controlled power and speed to ensure complete melting and secure bonding, thereby maintaining encapsulation integrity even if one frit delaminates, and allowing for smaller frit dimensions without high power laser irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single frit is used for encapsulation, then the encapsulation structure is simple, but the adhesive force is insufficient and oxygen or moisture may infiltrate if delamination occurs
Solution Approach 1:
The encapsulation frit is divided into multiple segments (first frit, second frit, and third frit) arranged in series around the pixel region. Each frit segment provides independent sealing, so if one segment delaminates, the other segments maintain encapsulation integrity and prevent oxygen or moisture infiltration.
2Strength
If laser power is increased to melt and adhere large frits on large substrates, then the encapsulation strength is improved, but the frit may crack or the light-emitting device may be damaged by excessive heat
Solution Approach 1:
The encapsulation process is divided into multiple laser irradiation steps, with each frit segment (first, second, and third frits) being melted and adhered separately using controlled laser power. This segmentation allows each frit to be processed at optimal lower power levels, preventing both frit cracking and heat damage to the light-emitting device while still achieving strong encapsulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and yield of organic light-emitting display devices by maintaining a hermetic seal and preventing moisture and oxygen infiltration, while avoiding frit cracking and excessive heating, thus improving the durability and performance of the encapsulation.
Implementation Method 1
the frit is melted and adhered to the substrate by irradiating a laser thereon
Data Source
Figure 1A~1B
Figure 2A~2C
Figure 3A~3B
AI summary
An organic light-emitting display device comprising: a pixel region (210) wherein an organic light-emitting device comprised of a first electrode , an organic thin film layer and a second electrode is formed; a first substrate (200) comprising a non-pixel region (220) encompassing the pixel region (210); a second substrate (300) disposed on the upper of the first substrate to be overlapped with the pixel region and a portion of the non-pixel region; and a plurality of frits (320,340) provided between the first substrate and the second substrate and formed in parallel at spaced intervals along the peripheral portion of the pixel region, wherein the first substrate is bonded to the second substrate by the plurality of frits. Even in the case that a portion of the frit is delaminated due to a partial defect thereof, its encapsulation state can be maintained as it is encapsulated with a multi frit structure and even in the case that a substrate with a large diameter is used, the width and height of the frit do not need to increase.